Effect of tensile uniaxial stress on the electron transport properties of deeply scaled FD-SOI n-type MOSFETs

Hasan M. Nayfeh, D. Singh, J. M. Hergenrother, J.W. Sleight, Zhibin Ren, O. Dokumaci, L. Black, D. Chidambarrao, R. Venigalla, James N. Pan,

IEEE Electron Device Letters · 2006 · 12 citations · 11 references

Concepts

Abstract

The effect of longitudinal uniaxial mechanical stress on electron mobility in high-performance fully depleted ultrathin silicon-on-insulator nFETs with a raised source/drain (RSD) architecture and channel lengths ranging from 1 μm (long channel) to 30 nm (deeply scaled) is reported. Longitudinal uniaxial stress in the channel was achieved using a stressed nitride contact liner technique. A dR/dL method was used to minimize errors in the mobility extraction due to uncertainties in external resistance and channel length. Significant mobility enhancement of 1.6-1.8 times was achieved despite the use of an RSD and strong channel doping of roughly 5×10/sup 18/ cm/sup -3/, required for short-channel effect control.

References

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