Concepedia

Packaging Design

Packaging Design is a design discipline focused on the conceptualization and development of functional containers that integrate structural, communicative, and aesthetic dimensions to protect, preserve, and present products.

3.8K

Publications

132.7K

Citations

11.9K

Authors

2.1K

Institutions

Publications per year

2017–2026

853

Parents

Children

Publications

3.8K

The importance of packaging attributes: a conjoint analysis approach

Pinya Silayoi, Mark Speece · European Journal of Marketing · 2007 · 691 citations

, , +11

Shelf management and space elasticity

Xavier Drèze, Stephen J. Hoch, Mary E. Purk · Journal of Retailing · 1994 · 661 citations

, , +9

Reliability challenges in 3D IC packaging technology

K. N. Tu · Microelectronics Reliability · 2010 · 636 citations

, , +13

Recent Advances and Trends in Advanced Packaging

John H. Lau · IEEE Transactions on Components Packaging and Manufacturing Technology · 2022 · 585 citations

, , +15

Packaging and purchase decisions

Pinya Silayoi, Mark Speece · British Food Journal · 2004 · 558 citations

, , +15

1–5 of 3.8K

Authors

11.9K

  1. JH
    John H. Lau

    Industrial Technology Research Institute, Taiwan

    67 publications · 3.4K citations

    30

    h-index

  2. SW
    S. W. Ricky Lee

    Hong Kong University of Science and Technology, Hong Kong SAR China

    27 publications · 829 citations

    19

    h-index

  3. RT
    Rao Tummala

    Georgia Institute of Technology, United States

    40 publications · 1.1K citations

    19

    h-index

  4. KC
    Kuo‐Ning Chiang

    National Tsing Hua University, Taiwan

    37 publications · 888 citations

    18

    h-index

  5. RA
    R. Aschenbrenner

    Fraunhofer Institute for Reliability and Microintegration, Germany

    23 publications · 582 citations

    16

    h-index

1–5 of 11.9K

Institutions

2.1K

  1. Georgia Institute of Technology

    Atlanta, United States

    30 h-index

    431 publications

    13.1K citations

  2. IBM (United States)

    Armonk, United States

    30 h-index

    275 publications

    11.1K citations

  3. Institute of Microelectronics

    Singapore, Singapore

    27 h-index

    390 publications

    11.5K citations

  4. Intel (United States)

    Santa Clara, United States

    24 h-index

    241 publications

    9.6K citations

  5. Delft University of Technology

    Delft, The Netherlands

    23 h-index

    100 publications

    5.3K citations

  6. Agency for Science, Technology and Research

    Singapore, Singapore

    23 h-index

    318 publications

    9.4K citations

  7. University of Maryland, College Park

    College Park, United States

    22 h-index

    98 publications

    2.5K citations

  8. Motorola (United States)

    Schaumburg, United States

    22 h-index

    172 publications

    3.7K citations

1–8 of 2.1K

Venues

  1. Microelectronics Reliability

    147 publications · 5.7K citations

    39

    h-index

  2. 33

    h-index

  3. IEEE Transactions on Advanced Packaging

    94 publications · 3.3K citations

    31

    h-index

  4. Packaging Technology and Science

    93 publications · 3.9K citations

    31

    h-index

  5. Journal of Electronic Packaging

    56 publications · 2.3K citations

    27

    h-index

1–5

See also

Packaging Design

Core Methods

Functions

Sustainability

Materials

Evaluation