Package Prototyping

Package Prototyping is a design development process that involves the creation of preliminary physical or digital models of packaging solutions to evaluate structural, functional, and aesthetic performance prior to final production.

Publications

473

Citations

Authors

Institutions

Publications per year

2017–2026

Parents

Packaging Design

Children

3D Printing For PackagingAssembly EfficiencyBarrier Performance EvaluationConsumer Usability TestingCorrugated Packaging PrototypingFlexible Packaging PrototypingFolding Carton PrototypingGlue Flap DesignMock-up CreationPackage Ergonomics

Publications

Accelerating structured consumer‐driven package design

Alex Gofman, Howard Moskowitz, Tõnis Mets · Journal of Consumer Marketing · 2010 · 73 citations

Arts, Design, Marketing +16

Utilizing inkjet printing to fabricate electrical interconnections in a system-in-package

Ville Pekkanen, Matti Mäntysalo, Kimmo Kaija et al. · Microelectronic Engineering · 2010 · 49 citations

Engineering, Electrical Engineering, Manufacturing Engineering +12

TXV Technology: The cornerstone of 3D system-in-packaging

Heran Zhao, Mingxiang Chen, Peng Yang et al. · Science China Technological Sciences · 2022 · 45 citations

Arts, Systems Engineering, Packaging Design +8

Therms-Up!: DIY Inflatables and Interactive Materials by Upcycling Wasted Thermoplastic Bags

Kyung Yun Choi, Hiroshi Ishii · 2021 · 38 citations

Arts, Materials Engineering, Materials Science +16

Advanced packaging of chiplets for future computing needs

Debendra Das Sharma, Ravi Mahajan · Nature Electronics · 2024 · 38 citations

Engineering, Computer Engineering, Computer Systems +12

1–5 of 18

Authors

MP
Michael Pecht
University of Maryland, College Park, United States
1 publications · 27 citations
1
h-index
FF
Francesc Ferrando
Universitat Rovira i Virgili, Spain
1 publications · 17 citations
1
h-index
SJ
Sungchul Joo
Georgia Institute of Technology, United States
1 publications · 17 citations
1
h-index
UL
Umezuruike Linus Opara
Stellenbosch University, South Africa
1 publications · 13 citations
1
h-index
AD
Abhijit Dasgupta
University of Maryland, College Park, United States
1 publications · 27 citations
1
h-index

1–5 of 81

Institutions

1–8 of 28

Venues

Microelectronic Engineering
2 publications · 75 citations
2
h-index
Microelectronics Reliability
2 publications · 20 citations
2
h-index
Science China Technological Sciences
1 publications · 45 citations
1
h-index
Finite Elements in Analysis and Design
1 publications · 27 citations
1
h-index
Journal of Food Engineering
1 publications · 13 citations
1
h-index

1–5