Inkjet printed System-in-Package design and manufacturing

J. Miettinen, Ville Pekkanen, Kimmo Kaija, +7

Microelectronics Journal

System design issues for 3D system-in-package (SiP)

J. Miettinen, Matti Mäntysalo, Kimmo Kaija, +1

EngineeringComputer ArchitectureSoftware EngineeringSystem-level Design3D Modeling +25

Evaluation of Inkjet Technology for Electronic Packaging and System Integration

Matti Mäntysalo, Pauliina Mansikkamäki, J. Miettinen, +11

EngineeringAdvanced Packaging (Semiconductors)Materials FabricationDigital FabricationPrinted Electronics +16

Utilizing inkjet printing to fabricate electrical interconnections in a system-in-package

Ville Pekkanen, Matti Mäntysalo, Kimmo Kaija, +7

Microelectronic Engineering

Industrial DesignElectrical EngineeringChip-scale PackageEngineeringAdvanced Packaging (Semiconductors) +5

Analysis of mechanical performance of silver inkjet-printed structures

Umur Caglar, Kimmo Kaija, Pauliina Mansikkamäki

Materials ScienceAdhesion PerformanceSinteringEngineeringSintered Silver Ink +11

Capability of inkjet technology in electronics manufacturing

Matti Mäntysalo, Ville Pekkanen, Kimmo Kaija, +5

Industrial DesignElectrical EngineeringInkjet TechnologyEngineeringIndustrial Engineering +11

The effect of conductor thickness in passive inkjet printed RFID tags

Juha Virtanen, Toni Björninen, Leena Ukkonen, +4

Rf DevicesElectrical EngineeringEngineeringInkjet TechnologyFlexible Electronics +10

Inkjetting dielectric layer for electronic applications

Kimmo Kaija, Ville Pekkanen, Matti Mäntysalo, +4

Microelectronic Engineering

Materials ScienceConducting PolymerElectrical EngineeringDielectricsDielectric Layer +6

Molded Substrates for Inkjet Printed Modules

J. Miettinen, Kimmo Kaija, Matti Mäntysalo, +6

IEEE Transactions on Components and Packaging Technologies

EngineeringMechanical EngineeringAdditive DepositionComputational FabricationAdvanced Packaging (Semiconductors) +14

Evaluation of printed electronics manufacturing line with sensor platform application

Eerik Halonen, Kimmo Kaija, Matti Mäntysalo, +3

Åbo Akademi University Research Portal