Kimmo Kaija

Inkjet printed System-in-Package design and manufacturing

J. Miettinen, Ville Pekkanen, Kimmo Kaija et al. · Microelectronics Journal · 2008 · 67 citations

System design issues for 3D system-in-package (SiP)

J. Miettinen, Matti Mäntysalo, Kimmo Kaija et al. · 2004 · 66 citations

Engineering, Computer Architecture, Software Engineering +27

Evaluation of Inkjet Technology for Electronic Packaging and System Integration

Matti Mäntysalo, Pauliina Mansikkamäki, J. Miettinen et al. · 2007 · 55 citations

Engineering, Advanced Packaging (Semiconductors), Materials Fabrication +18

Utilizing inkjet printing to fabricate electrical interconnections in a system-in-package

Ville Pekkanen, Matti Mäntysalo, Kimmo Kaija et al. · Microelectronic Engineering · 2010 · 49 citations

Industrial Design, Electrical Engineering, Chip-scale Package +7

Analysis of mechanical performance of silver inkjet-printed structures

Umur Caglar, Kimmo Kaija, Pauliina Mansikkamäki · 2008 · 43 citations

Materials Science, Adhesion Performance, Sintering +13