J. Miettinen

Inkjet printed System-in-Package design and manufacturing

J. Miettinen, Ville Pekkanen, Kimmo Kaija et al. · Microelectronics Journal · 2008 · 67 citations

System design issues for 3D system-in-package (SiP)

J. Miettinen, Matti Mäntysalo, Kimmo Kaija et al. · 2004 · 66 citations

Engineering, Computer Architecture, Software Engineering +27

Evaluation of Inkjet Technology for Electronic Packaging and System Integration

Matti Mäntysalo, Pauliina Mansikkamäki, J. Miettinen et al. · 2007 · 55 citations

Engineering, Advanced Packaging (Semiconductors), Materials Fabrication +18

Stacked Modular Package

S. Pienimaa, J. Miettinen, E. Ristolainen · IEEE Transactions on Advanced Packaging · 2004 · 28 citations

Engineering, Computer Architecture, Advanced Packaging (Semiconductors) +18

Molded Substrates for Inkjet Printed Modules

J. Miettinen, Kimmo Kaija, Matti Mäntysalo et al. · IEEE Transactions on Components and Packaging Technologies · 2009 · 16 citations

Engineering, Mechanical Engineering, Additive Deposition +16