IEEE Transactions on Advanced Packaging

Foreword contributions from the 50th electronic components and technology conference

R. Boudreau · 2001 · 519 citations

Engineering, Computer Engineering, Electrical Engineering +16

Power distribution system design methodology and capacitor selection for modern CMOS technology

L.D. Smith, Richard E. Anderson, D. Forehand et al. · 1999 · 490 citations

Engineering, Electrical Engineering, Circuit Theory +16

Design and Characterization of Purely Textile Patch Antennas

I. Locher, Maciej Klemm, Tnde Kirstein et al. · 2006 · 453 citations · Full text

Engineering, Electrical Engineering, Materials Science +17

Stability, Causality, and Passivity in Electrical Interconnect Models

Piero Triverio, S. Grivet‐Talocia, M. Nakhla et al. · 2007 · 301 citations · Full text

Engineering, Electrical Engineering, Systems Engineering +14

Nonlinear Thermal Stress/Strain Analyses of Copper Filled TSV (Through Silicon Via) and Their Flip-Chip Microbumps

Cheryl Selvanayagam, John H. Lau, Xiaowu Zhang et al. · 2009 · 295 citations

Engineering, Materials Engineering, Materials Science +16