Cheryl Selvanayagam

Nonlinear Thermal Stress/Strain Analyses of Copper Filled TSV (Through Silicon Via) and Their Flip-Chip Microbumps

Cheryl Selvanayagam, John H. Lau, Xiaowu Zhang et al. · IEEE Transactions on Advanced Packaging · 2009 · 295 citations

Engineering, Materials Engineering, Materials Science +16

Development of through silicon via (TSV) interposer technology for large die (21×21mm) fine-pitch Cu/low-k FCBGA package

Xiaowu Zhang, T.C. Chai, John H. Lau et al. · 2009 · 109 citations

Engineering, Computer Engineering, Electrical Engineering +17

Nonlinear thermal stress/strain analyses of copper filled TSV (through silicon via) and their flip-chip microbumps

Cheryl Selvanayagam, John H. Lau, Xiaowu Zhang et al. · 2008 · 96 citations

Engineering, Materials Engineering, Materials Science +16

Stress–Strain Characteristics of Tin-Based Solder Alloys for Drop-Impact Modeling

E.H. Wong, Cheryl Selvanayagam, S.K.W. Seah et al. · Journal of Electronic Materials · 2008 · 79 citations

Natural Sciences, Materials Engineering, Materials Science +16

Development of Large Die Fine-Pitch Cu/Low-$k$ FCBGA Package With Through Silicon via (TSV) Interposer

Tai Chong Chai, Xiaowu Zhang, John H. Lau et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2011 · 55 citations

Engineering, Electrical Engineering, Electronic Materials +16