Tai Chong Chai - Concepedia

Author

Tai Chong Chai

Institute of Microelectronics

Also Known As

Bang, Tai C. Chai, Tai Chai, Tai Chong Chai, Tai chong Chai

Publications

639

Citations

H-Index

Concepts

All Affiliations

Institute of Microelectronics Agency for Science, Technology and Research Institute of High Performance Computing Institute of Materials Research and Engineering Industrial Technology Research Institute

About

Tai Chong Chai is an author at Institute of Microelectronics specializing in engineering, electronic packaging, and microelectronics.

Top Concepts

#	Concept	H-Index	Publications	Citations
1	Engineering	13	17	454
2	Electrical Engineering	11	12	296
3	Applied Physics	5	5	118
4	Computer Engineering	4	4	95
5	Civil Engineering	1	1	16

Tai Chong Chai

Publications

464

Citations

H-Index

Page 1

	Year	Citations
The mechanics of the solder ball shear test and the effect of shear rate Julian Yan Hon Chia, Brian Cotterell, Tai Chong Chai Materials Science and Engineering A EngineeringMechanicsMechanical EngineeringRheologySolid Mechanics	2005	92
Development of Large Die Fine-Pitch Cu/Low-$k$ FCBGA Package With Through Silicon via (TSV) Interposer Tai Chong Chai, Xiaowu Zhang, John H. Lau, IEEE Transactions on Components Packaging and Manufacturing Technology EngineeringIntegrated CircuitsContinuous PushInterconnect (Integrated Circuits)Daisy Chain	2011	52
Thermal Optimization and Characterization of SiC-Based High Power Electronics Packages With Advanced Thermal Design Gongyue Tang, Tai Chong Chai, Xiaowu Zhang IEEE Transactions on Components Packaging and Manufacturing Technology EngineeringLiquid Metal CoolingEnergy EfficiencyPower PackagePower Electronics	2019	45
Reliability of a Silicon Stacked Module for 3-D SiP Microsystem Seung Wook Yoon, SoonThor Lim, A.G.K. Viswanath, IEEE Transactions on Advanced Packaging Flip Chip3D Ic ArchitectureElectrical EngineeringChip-scale PackageEngineering	2008	34
Electromigration study of 50 &#x00B5;m pitch micro solder bumps using four-point Kelvin structure Daquan Yu, Tai Chong Chai, Meei Ling Thew, Electrical ResistanceEngineeringMechanical EngineeringMum PitchInterconnect (Integrated Circuits)	2009	28
Reliability Studies of a Through Via Silicon Stacked Module for 3D Microsystem Packaging Seung Wook Yoon, D. Witarsa, S. Yak, EngineeringMicrosystem PackagingMechanical EngineeringReliability EngineeringAdvanced Packaging (Semiconductors)	2006	27
In Situ Measurement and Stress Evaluation for Wire Bonding Using Embedded Piezoresistive Stress Sensors Woon Yik Yong, Xiaowu Zhang, Tai Chong Chai, IEEE Transactions on Components Packaging and Manufacturing Technology EngineeringInverse FftMechanical EngineeringSensor TechnologyFast Fourier Transform	2013	22
Failure Mode and Mechanism Analysis for Cu Wire Bond on Cu/Low-k Chip by Wire Pull Test and Finite-Element Analysis Fa Xing, Leong Ching Wai, Tai Chong Chai IEEE Transactions on Device and Materials Reliability Materials ScienceElectrical EngineeringEngineeringHardware ReliabilityBond Pad Reliability	2018	22
3-D Numerical and Experimental Investigations on Compression Molding in Multichip Embedded Wafer Level Packaging Lin Ji, Dexter Velez Sorono, Tai Chong Chai, IEEE Transactions on Components Packaging and Manufacturing Technology EngineeringMechanical EngineeringComputer-aided DesignComputational MechanicsMolding (Process)	2012	21
Study on Warpage and Reliability of Fan-Out Interposer Technology Fa Xing, David Ho, Tai Chong Chai IEEE Transactions on Components Packaging and Manufacturing Technology Foi TechnologyElectrical EngineeringFan-out Interposer TechnologyEngineeringChip-scale Package	2018	18

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