Tai Chong Chai

The mechanics of the solder ball shear test and the effect of shear rate

Julian Yan Hon Chia, Brian Cotterell, Tai Chong Chai · Materials Science and Engineering A · 2005 · 92 citations

Engineering, Mechanics, Mechanical Engineering +4

Development of Large Die Fine-Pitch Cu/Low-$k$ FCBGA Package With Through Silicon via (TSV) Interposer

Tai Chong Chai, Xiaowu Zhang, John H. Lau et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2011 · 52 citations

Engineering, Integrated Circuits, Continuous Push +16

Thermal Optimization and Characterization of SiC-Based High Power Electronics Packages With Advanced Thermal Design

Gongyue Tang, Tai Chong Chai, Xiaowu Zhang · IEEE Transactions on Components Packaging and Manufacturing Technology · 2019 · 45 citations

Engineering, Liquid Metal Cooling, Energy Efficiency +19

Reliability of a Silicon Stacked Module for 3-D SiP Microsystem

Seung Wook Yoon, SoonThor Lim, A.G.K. Viswanath et al. · IEEE Transactions on Advanced Packaging · 2008 · 34 citations

Flip Chip, 3D Ic Architecture, Electrical Engineering +15

Electromigration study of 50 µm pitch micro solder bumps using four-point Kelvin structure

Daquan Yu, Tai Chong Chai, Meei Ling Thew et al. · 2009 · 28 citations

Electrical Resistance, Engineering, Mechanical Engineering +17