Daquan Yu - Concepedia

Author

Daquan Yu

Xiamen University of Technology ORCID

Also Known As

D Q Yu, D. Q. Yu, D. Yu, D.Q. Yu, Da-Quan Yu, Da-quan Yu, Daquan YU, Daquan Yu, De-Bao Yu, Debao Yu

264

Publications

3.5K

Citations

H-Index

Concepts

All Affiliations

Xiamen University of Technology Dalian University of Technology Agency for Science, Technology and Research Institute of Microelectronics Chinese Academy of Sciences

About

Daquan Yu is an author at Xiamen University of Technology specializing in engineering, materials science, and electronic packaging.

Top Concepts

#	Concept	H-Index	Publications	Citations
1	Engineering	27	56	2.7K
2	Applied Physics	16	22	829
3	Biomedical Engineering	2	2	27
4	Chemical Engineering	2	2	166
5	Social Sciences	1	1	11

Daquan Yu

Publications

2.9K

Citations

H-Index

Page 1

	Year	Citations
Properties of lead-free solder alloys with rare earth element additions Chi‐Man Lawrence Wu, Daquan Yu, C. Law, Materials Science and Engineering R Reports Materials ScienceMaterials EngineeringRare Earth MineralEngineeringCorrosion	2004	583
Investigation of interfacial microstructure and wetting property of newly developed Sn–Zn–Cu solders with Cu substrate Daquan Yu, Hong‐Bin Xie, Lu Wang Journal of Alloys and Compounds Materials ScienceMaterials EngineeringCu SubstrateEngineeringSurface Processing	2004	136
The properties of Sn-9Zn lead-free solder alloys doped with trace rare earth elements Chi‐Man Lawrence Wu, Daquan Yu, C. Law, Journal of Electronic Materials Materials ScienceMaterials EngineeringRare Earth MineralEngineeringCorrosion	2002	123
The wettability and microstructure of Sn-Zn-RE alloys Chi‐Man Lawrence Wu, C. Law, Daquan Yu, Journal of Electronic Materials Materials ScienceMaterials EngineeringEngineeringCorrosionAlloy Design	2003	114
Intermetallic compounds growth between Sn–3.5Ag lead-free solder and Cu substrate by dipping method Daquan Yu, Chi‐Man Lawrence Wu, C. Law, Journal of Alloys and Compounds Materials ScienceMaterials EngineeringCu SubstrateEngineeringSn–3.5ag Lead-free Solder	2004	113
Microstructure and mechanical properties of new lead-free Sn-Cu-RE solder alloys Chi‐Man Lawrence Wu, Daquan Yu, C. Law, Journal of Electronic Materials Materials EngineeringMaterials ScienceEngineeringMechanical PropertiesCorrosion	2002	88
Electrochemical migration of Sn-Pb and lead free solder alloys under distilled water Daquan Yu, W. Jillek, E. Schmitt Journal of Materials Science Materials in Electronics Materials ScienceChemical EngineeringEngineeringElectrochemical MigrationCorrosion	2006	86
Microstructure, solderability, and growth of intermetallic compounds of Sn-Ag-Cu-RE lead-free solder alloys C. Law, Chi‐Man Lawrence Wu, Daquan Yu, Journal of Electronic Materials Materials ScienceMaterials EngineeringIntermetallic CompoundsEngineeringCorrosion	2006	85
The formation of nano-Ag3Sn particles on the intermetallic compounds during wetting reaction Daquan Yu, Lu Wang, Chi‐Man Lawrence Wu, Journal of Alloys and Compounds Materials ScienceChemical EngineeringIntermetallic CompoundsEngineeringMetal Nanoparticles	2004	80
Electromigration performance of Through Silicon Via (TSV) – A modeling approach Yung Chuen Tan, Cher Ming Tan, Xiaowu Zhang, Microelectronics Reliability Device ModelingElectrical EngineeringElectromigration TechniqueEngineeringAdvanced Packaging (Semiconductors)	2010	72

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