The wettability and microstructure of Sn-Zn-RE alloys

Wetting and interface microstructure between Sn–Zn binary alloys and Cu

Katsuaki Suganuma, Koichi Niihara, Takeshi Shoutoku et al. · Journal of materials research/Pratt's guide to venture capital sources · 1998 · 216 citations

Natural Sciences, Materials Engineering, Materials Science +14

New lead-free, Sn-Zn-In solder alloys

M. McCormack, S. Jin, H. S. Chen et al. · Journal of Electronic Materials · 1994 · 149 citations

Natural Sciences, Materials Engineering, Materials Science +9

Heat Resistance of Sn–9Zn Solder/Cu Interface with or without Coating

Katsuaki Suganuma, Toshikazu Murata, Hiroji Noguchi et al. · Journal of materials research/Pratt's guide to venture capital sources · 2000 · 140 citations

Natural Sciences, Materials Engineering, Materials Science +16

The properties of Sn-9Zn lead-free solder alloys doped with trace rare earth elements

Chi‐Man Lawrence Wu, Daquan Yu, C. Law et al. · Journal of Electronic Materials · 2002 · 123 citations

Natural Sciences, Materials Engineering, Materials Science +10

Microstructure and mechanical properties of new lead-free Sn-Cu-RE solder alloys

Chi‐Man Lawrence Wu, Daquan Yu, C. Law et al. · Journal of Electronic Materials · 2002 · 88 citations

Natural Sciences, Materials Engineering, Materials Science +14