C. Law - Concepedia

Concepedia

Author

C. Law

City University of Hong Kong

Also Known As

C Law, C. Law, C. M. T. Law, C.M Law, C.M. Law, C.M.T. Law, CK Law, Cheh Pau Law, Law, Ching

33

Publications

1.5K

Citations

13

H-Index

34

Concepts

All Affiliations

City University of Hong Kong Dalian University of Technology Hong Kong Polytechnic University Princeton University Shandong University

CL

About

C. Law is an author at City University of Hong Kong specializing in engineering, materials science, and materials engineering.

Top Concepts

#	Concept	H-Index	Publications	Citations
1	Engineering	13	16	1.5K
2	Applied Physics	5	5	304
3	Chemistry	4	4	227
4	Chemical Engineering	3	3	114
5	Natural Sciences	1	2	22

C. Law

×

15

Publications

1.5K

Citations

13

H-Index

	Year	Citations
Properties of lead-free solder alloys with rare earth element additions Chi‐Man Lawrence Wu, Daquan Yu, C. Law, Materials Science and Engineering R Reports Materials ScienceMaterials EngineeringRare Earth MineralEngineeringCorrosion	2004	583
The properties of Sn-9Zn lead-free solder alloys doped with trace rare earth elements Chi‐Man Lawrence Wu, Daquan Yu, C. Law, Journal of Electronic Materials Materials ScienceMaterials EngineeringRare Earth MineralEngineeringCorrosion	2002	123
The wettability and microstructure of Sn-Zn-RE alloys Chi‐Man Lawrence Wu, C. Law, Daquan Yu, Journal of Electronic Materials Materials ScienceMaterials EngineeringEngineeringCorrosionAlloy Design	2003	114
Intermetallic compounds growth between Sn–3.5Ag lead-free solder and Cu substrate by dipping method Daquan Yu, Chi‐Man Lawrence Wu, C. Law, Journal of Alloys and Compounds Materials ScienceMaterials EngineeringCu SubstrateEngineeringSn–3.5ag Lead-free Solder	2004	113
Crack propagation from 3-D surface fractures in PMMA and marble specimens under uniaxial compression R.H.C. Wong, C. Law, K.T. Chau, International Journal of Rock Mechanics and Mining Sciences Crack PropagationEngineeringStrain LocalizationMechanicsMechanical Engineering	2004	93
Microstructure and mechanical properties of new lead-free Sn-Cu-RE solder alloys Chi‐Man Lawrence Wu, Daquan Yu, C. Law, Journal of Electronic Materials Materials EngineeringMaterials ScienceEngineeringMechanical PropertiesCorrosion	2002	88
Microstructure, solderability, and growth of intermetallic compounds of Sn-Ag-Cu-RE lead-free solder alloys C. Law, Chi‐Man Lawrence Wu, Daquan Yu, Journal of Electronic Materials Materials ScienceMaterials EngineeringIntermetallic CompoundsEngineeringCorrosion	2006	85
The formation of nano-Ag3Sn particles on the intermetallic compounds during wetting reaction Daquan Yu, Lu Wang, Chi‐Man Lawrence Wu, Journal of Alloys and Compounds Materials ScienceChemical EngineeringIntermetallic CompoundsEngineeringMetal Nanoparticles	2004	80
Improvements of microstructure, wettability, tensile and creep strength of eutectic Sn–Ag alloy by doping with rare-earth elements Chi‐Man Lawrence Wu, Daquan Yu, C. Law, Journal of materials research/Pratt's guide to venture capital sources Materials ScienceMaterials EngineeringRare-earth ElementsEngineeringApplied Physics	2002	62
Crack propagation from 3-d surface fractures in pmma and marble specimens under uniaxial compression R.H.C. Wong, C. Law, K.T. Chau, International Journal of Rock Mechanics and Mining Sciences Crack PropagationEngineeringStrain LocalizationMechanicsMechanical Engineering	2004	53

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