Intermetallic compounds growth between Sn–3.5Ag lead-free solder and Cu substrate by dipping method - Concepedia

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Intermetallic compounds growth between Sn–3.5Ag lead-free solder and Cu substrate by dipping method

113

Citations

22

References

2004

Year

Daquan Yu, Chi‐Man Lawrence Wu, C. Law, Lu Wang, J.K.L. Lai

Journal of Alloys and Compounds

Materials ScienceMaterials EngineeringCu SubstrateEngineeringSn–3.5ag Lead-free SolderSurface ScienceMetallurgical ProcessChemistryMetal Processing

References

	Year	Citations

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