J.K.L. Lai

Recent developments in stainless steels

Kin Ho Lo, C.H. Shek, J.K.L. Lai · Materials Science and Engineering R Reports · 2009 · 2.2K citations

Natural Sciences, Materials Engineering, Materials Science +10

Transformation evolution and infrared absorption spectra of amorphous and crystalline nano-Al2O3 powders

C.H. Shek, J.K.L. Lai, Ting Gu et al. · Nanostructured Materials · 1997 · 169 citations

Natural Sciences, Materials Engineering, Materials Science +16

Growth kinetic studies of Cu–Sn intermetallic compound and its effect on shear strength of LCCC SMT solder joints

Y.C. Chan, A.C.K. So, J.K.L. Lai · Materials Science and Engineering B · 1998 · 165 citations

Natural Sciences, Materials Engineering, Materials Science +16

Effect of intermetallic compounds on the thermal fatigue of surface mount solder joints

P.L. Tu, Y.C. Chan, J.K.L. Lai · IEEE Transactions on Components Packaging and Manufacturing Technology Part B · 1997 · 150 citations

Natural Sciences, Materials Engineering, Materials Science +17

Growth kinetics of intermetallic compounds in chip scale package solder joint

P.L. Tu, Y.C. Chan, K.C. Hung et al. · Scripta Materialia · 2001 · 140 citations

Natural Sciences, Materials Engineering, Materials Science +13