K.C. Hung

Growth kinetics of intermetallic compounds in chip scale package solder joint

P.L. Tu, Y.C. Chan, K.C. Hung et al. · Scripta Materialia · 2001 · 140 citations

Natural Sciences, Materials Engineering, Materials Science +13

Reliability study of the electroless Ni–P layer against solder alloy

M.O. Alam, Y. C. Chan, K.C. Hung · Microelectronics Reliability · 2002 · 125 citations

Engineering, Materials Engineering, Materials Science +16

The synthesis and characterization of HgBa2Ca2Cu3O8+δ superconductors with substitution of Hg by Pb

H.M. Shao, C.C. Lam, P. C. W. Fung et al. · Physica C Superconductivity · 1995 · 68 citations

Natural Sciences, Materials Science, Physics +7

The 6-4 photoproduct is the trigger of UV-induced replication blockage and ATR activation

K.C. Hung, Julia M. Sidorova, Paul Nghiem et al. · Proceedings of the National Academy of Sciences · 2020 · 65 citations · Full text

Life Sciences, Cell Biology, Molecular Biology +17

The biphasic differential expression of the cellular membrane protein, caveolin‐1, in oral carcinogenesis

K.C. Hung, Shu‐Chun Lin, Chung‐Ji Liu et al. · Journal of Oral Pathology and Medicine · 2003 · 64 citations

Medicine, Oncology, Oral Pathology +11