Concepedia

M.O. Alam

MA

37

Publications

1.7K

Citations

22

H-Index

2002

Active since

Affiliations

City University of Hong Kong(Current)

University of Greenwich

University of California, Los Angeles

Hodges University

Semiconductor Manufacturing International (Italy)

M.O. Alam is an author at City University of Hong Kong specializing in engineering, materials science, and electronic packaging.

Top concepts

EngineeringMaterial ScienceElectronic PackagingMicrostructureMechanical EngineeringMaterials EngineeringApplied PhysicsElectrical EngineeringMechanics Of MaterialsCorrosion

Publications per year

2002–2013

37

Publications

37

Thermal interface materials for automotive electronic control unit: Trends, technology and R&D challenges

Kenny C. Otiaba, N.N. Ekere, Raj Bhatti et al. · Microelectronics Reliability · 2011 · 142 citations

Materials Science, Electrical Engineering, Engineering +11

Investigations on microhardness of Sn–Zn based lead-free solder alloys as replacement of Sn–Pb solder

Rashed Adnan Islam, Bin Wu, M.O. Alam et al. · Journal of Alloys and Compounds · 2005 · 129 citations

Materials Engineering, Materials Science, Sn–pb Solder +7

Reliability study of the electroless Ni–P layer against solder alloy

M.O. Alam, Y. C. Chan, K.C. Hung · Microelectronics Reliability · 2002 · 125 citations

Materials Science, Electrical Engineering, Engineering +5

Effect of reaction time and P content on mechanical strength of the interface formed between eutectic Sn–Ag solder and Au/electroless Ni(P)/Cu bond pad

M.O. Alam, Y.C. Chan, K. N. Tu · Journal of Applied Physics · 2003 · 111 citations

Engineering, Mechanical Engineering, Reaction Time +19

Adhesion strength and contact resistance of flip chip on flex packages––effect of curing degree of anisotropic conductive film

Mohammad Afsar Uddin, M.O. Alam, Y.C. Chan et al. · Microelectronics Reliability · 2003 · 100 citations

Materials Science, Flip Chip, Chip-scale Package +9

Rows per page

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