Concepedia

Y. C. Chan

YC

32

Publications

1.2K

Citations

19

H-Index

1997

Active since

Affiliations

City University of Hong Kong(Current)

Hong Kong Polytechnic University

University of Greenwich

National Yang Ming Chiao Tung University

Loughborough University

Y. C. Chan is an author at City University of Hong Kong specializing in materials science, engineering, and applied physics.

ORCID

Top concepts

Publications per year

1997–2021

32

Publications

32

Growth mechanism of Ni3Sn4 in a Sn/Ni liquid/solid interfacial reaction

Jun Shen, Y. C. Chan, S.Y. Liu · Acta Materialia · 2009 · 128 citations

, , +7

Reliability study of the electroless Ni–P layer against solder alloy

M.O. Alam, Y. C. Chan, K.C. Hung · Microelectronics Reliability · 2002 · 125 citations

, , +5

Microstructure, thermal analysis and hardness of a Sn–Ag–Cu–1wt% nano-TiO2 composite solder on flexible ball grid array substrates

Asit Kumar Gain, Y. C. Chan, K.C. Yung · Microelectronics Reliability · 2011 · 109 citations

, , +4

The influence of addition of Al nano-particles on the microstructure and shear strength of eutectic Sn–Ag–Cu solder on Au/Ni metallized Cu pads

Asit Kumar Gain, Tama Fouzder, Y. C. Chan et al. · Journal of Alloys and Compounds · 2010 · 81 citations

, , +8

Effect of volume in interfacial reaction between eutectic Sn–Pb solder and Cu metallization in microelectronic packaging

Ahmed Sharif, Y. C. Chan, Rashed Adnan Islam · Materials Science and Engineering B · 2003 · 66 citations

, , +8

Rows per page

1–5 of 32