The influence of addition of Al nano-particles on the microstructure and shear strength of eutectic Sn–Ag–Cu solder on Au/Ni metallized Cu pads - Concepedia

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The influence of addition of Al nano-particles on the microstructure and shear strength of eutectic Sn–Ag–Cu solder on Au/Ni metallized Cu pads

81

Citations

26

References

2010

Year

Asit Kumar Gain, Tama Fouzder, Y. C. Chan, Ahmed Sharif, N. B. Wong, K.C. Yung

Journal of Alloys and Compounds

Materials EngineeringMaterials ScienceEngineeringMechanical PropertiesMechanical EngineeringMetallurgical ProcessShear StrengthAl Nano-particlesCu PadsMicrostructureMetal Processing

References

	Year	Citations

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