Concepedia

Author

Tama Fouzder

City University of Hong KongORCID

Also Known As

T. Fouzder, Tama Fouzder

29

Publications

463

Citations

9

H-Index

14

Concepts

All Affiliations

City University of Hong KongHong Kong Polytechnic UniversityBangladesh University of Engineering and Technology
TF

About

Tama Fouzder is an author at City University of Hong Kong specializing in materials science, engineering, and materials engineering.

Top Concepts

#ConceptH-IndexPublicationsCitations

1

Engineering

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9

431

2

Materials Science

9

9

431

3

Materials Engineering

7

7

403

4

Applied Physics

3

3

121

5

Chemical Engineering

2

2

35

Tama Fouzder

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9

Publications

431

Citations

9

H-Index

YearCitations

Microstructure, kinetic analysis and hardness of Sn–Ag–Cu–1wt% nano-ZrO2 composite solder on OSP-Cu pads

Asit Kumar Gain, Tama Fouzder, Y.C. Chan,

Journal of Alloys and Compounds

2010

97

The influence of addition of Al nano-particles on the microstructure and shear strength of eutectic Sn–Ag–Cu solder on Au/Ni metallized Cu pads

Asit Kumar Gain, Tama Fouzder, Y. C. Chan,

Journal of Alloys and Compounds

2010

81

Influence of SrTiO3 nano-particles on the microstructure and shear strength of Sn–Ag–Cu solder on Au/Ni metallized Cu pads

Tama Fouzder, Shafiq Ismathullakhan, Y.C. Chan,

Journal of Alloys and Compounds

2010

72

Influence of Ag micro-particle additions on the microstructure, hardness and tensile properties of Sn–9Zn binary eutectic solder alloy

Mansur Ahmed, Tama Fouzder, Ahmed Sharif,

Microelectronics Reliability

2010

59

Effect of nano Al2O3 additions on the microstructure, hardness and shear strength of eutectic Sn–9Zn solder on Au/Ni metallized Cu pads

Tama Fouzder, Asit Kumar Gain, Y.C. Chan,

Microelectronics Reliability

2010

38

Investigation of small Sn–3.5Ag–0.5Cu additions on the microstructure and properties of Sn–8Zn–3Bi solder on Au/Ni/Cu pads

Asit Kumar Gain, Tama Fouzder, Y.C. Chan,

Journal of Alloys and Compounds

2009

32

Influence of cerium oxide (CeO2) nanoparticles on the microstructure and hardness of tin–silver–copper (Sn–Ag–Cu) solders on silver (Ag) surface-finished copper (Cu) substrates

Tama Fouzder, Y.C. Chan, Daniel K. Chan

Journal of Materials Science Materials in Electronics

2014

24

Interfacial microstructure and hardness of nickel (Ni) nanoparticle-doped tin–silver–copper (Sn–Ag–Cu) solders on immersion silver (Ag)-plated copper (Cu) substrates

Tama Fouzder, Qingqian Li, Y.C. Chan,

Journal of Materials Science Materials in Electronics

2014

17

Microstructure and kinetic analysis of the properties and behavior of nickel (Ni) nano-particle doped tin–zinc–bismuth (Sn–8Zn–3Bi) solders on immersion silver (Ag)-plated copper (Cu) substrates

Tama Fouzder, Qingqian Li, Y.C. Chan,

Journal of Materials Science Materials in Electronics

2014

11

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