Concepedia
Statistics
Publications
67
Citations
2.7K
H-Index
32
Active since
1995
Affiliations
City University of Hong Kong(Current)
University of Greenwich
Hong Kong Polytechnic University
Loughborough University
Y.C. Chan is an author at City University of Hong Kong specializing in materials engineering, materials science, and natural sciences.
Publications per year
1995–2018
Growth kinetic studies of Cu–Sn intermetallic compound and its effect on shear strength of LCCC SMT solder joints
Y.C. Chan, A.C.K. So, J.K.L. Lai · Materials Science and Engineering B · 1998 · 165 citations
Natural Sciences, Materials Engineering, Materials Science +16
Effect of intermetallic compounds on the thermal fatigue of surface mount solder joints
P.L. Tu, Y.C. Chan, J.K.L. Lai · IEEE Transactions on Components Packaging and Manufacturing Technology Part B · 1997 · 150 citations
Natural Sciences, Materials Engineering, Materials Science +17
Interfacial intermetallic growth and mechanical properties of carbon nanotubes reinforced Sn3.5Ag0.5Cu solder joint under current stressing
Sha Xu, Y.C. Chan, Kaili Zhang et al. · Journal of Alloys and Compounds · 2014 · 128 citations
Effect of silver (Ag) nanoparticle size on the microstructure and mechanical properties of Sn58Bi–Ag composite solders
Yi Li, Y.C. Chan · Journal of Alloys and Compounds · 2015 · 126 citations
Effects of bonding parameters on the reliability performance of anisotropic conductive adhesive interconnects for flip-chip-on-flex packages assembly I. Different bonding temperature
Y.C. Chan, D.Y Luk · Microelectronics Reliability · 2002 · 117 citations
Engineering, Materials Engineering, Materials Science +17
1–5 of 67