Concepedia

Y.C. Chan

YC

Statistics

Publications

67

Citations

2.7K

H-Index

32

Active since

1995

Affiliations

City University of Hong Kong(Current)

University of Greenwich

Hong Kong Polytechnic University

Loughborough University

Y.C. Chan is an author at City University of Hong Kong specializing in materials engineering, materials science, and natural sciences.

Publications per year

1995–2018

67

Publications

67

Growth kinetic studies of Cu–Sn intermetallic compound and its effect on shear strength of LCCC SMT solder joints

Y.C. Chan, A.C.K. So, J.K.L. Lai · Materials Science and Engineering B · 1998 · 165 citations

, , +16

Effect of intermetallic compounds on the thermal fatigue of surface mount solder joints

P.L. Tu, Y.C. Chan, J.K.L. Lai · IEEE Transactions on Components Packaging and Manufacturing Technology Part B · 1997 · 150 citations

, , +17

Interfacial intermetallic growth and mechanical properties of carbon nanotubes reinforced Sn3.5Ag0.5Cu solder joint under current stressing

Sha Xu, Y.C. Chan, Kaili Zhang et al. · Journal of Alloys and Compounds · 2014 · 128 citations

, , +17

Effect of silver (Ag) nanoparticle size on the microstructure and mechanical properties of Sn58Bi–Ag composite solders

Yi Li, Y.C. Chan · Journal of Alloys and Compounds · 2015 · 126 citations

, , +16

Effects of bonding parameters on the reliability performance of anisotropic conductive adhesive interconnects for flip-chip-on-flex packages assembly I. Different bonding temperature

Y.C. Chan, D.Y Luk · Microelectronics Reliability · 2002 · 117 citations

, , +17

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