Y.C. Chan

Growth kinetic studies of Cu–Sn intermetallic compound and its effect on shear strength of LCCC SMT solder joints

Y.C. Chan, A.C.K. So, J.K.L. Lai · Materials Science and Engineering B · 1998 · 164 citations

Materials Science, Friction Welding, Engineering +7

Effect of intermetallic compounds on the thermal fatigue of surface mount solder joints

P.L. Tu, Y.C. Chan, J.K.L. Lai · IEEE Transactions on Components Packaging and Manufacturing Technology Part B · 1997 · 149 citations

Imc Layer, Engineering, Friction Welding +20

Interfacial intermetallic growth and mechanical properties of carbon nanotubes reinforced Sn3.5Ag0.5Cu solder joint under current stressing

Sha Xu, Y.C. Chan, Kaili Zhang et al. · Journal of Alloys and Compounds · 2014 · 128 citations

Materials Science, Materials Engineering, Current Stressing +6

Effect of silver (Ag) nanoparticle size on the microstructure and mechanical properties of Sn58Bi–Ag composite solders

Yi Li, Y.C. Chan · Journal of Alloys and Compounds · 2015 · 120 citations

Materials Science, Engineering, Mechanical Properties +7

Effects of bonding parameters on the reliability performance of anisotropic conductive adhesive interconnects for flip-chip-on-flex packages assembly I. Different bonding temperature

Y.C. Chan, D.Y Luk · Microelectronics Reliability · 2002 · 117 citations

Materials Science, Different Bonding Temperature, Flip-chip-on-flex Packages +10