Concepedia

P.L. Tu

PT

Statistics

Publications

13

Citations

609

H-Index

11

Active since

1997

Affiliations

City University of Hong Kong(Current)

P.L. Tu is an author at City University of Hong Kong specializing in materials engineering, materials science, and mechanical behavior of materials.

Publications per year

1997–2002

13

Publications

13

Effect of intermetallic compounds on the thermal fatigue of surface mount solder joints

P.L. Tu, Y.C. Chan, J.K.L. Lai · IEEE Transactions on Components Packaging and Manufacturing Technology Part B · 1997 · 150 citations

, , +17

Growth kinetics of intermetallic compounds in chip scale package solder joint

P.L. Tu, Y.C. Chan, K.C. Hung et al. · Scripta Materialia · 2001 · 140 citations

, , +13

Effect of intermetallic compounds on the shear fatigue of Cu/63Sn-37Pb solder joints

Y.C. Chan, P.L. Tu, A.C.K. So et al. · IEEE Transactions on Components Packaging and Manufacturing Technology Part B · 1997 · 67 citations

, , +17

Reliability studies μBGA solder joints-effect of Ni-Sn intermetallic compound

Y.C. Chan, P.L. Tu, Chengcheng Tang et al. · IEEE Transactions on Advanced Packaging · 2001 · 60 citations

, , +15

Effect of intermetallic compounds on vibration fatigue of μBGA solder joint

P.L. Tu, Y.C. Chan, J.K.L. Lai · IEEE Transactions on Advanced Packaging · 2001 · 48 citations

, , +16

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