Concepedia

A.C.K. So

AS

6

Publications

403

Citations

6

H-Index

1996

Active since

Affiliations

City University of Hong Kong(Current)

A.C.K. So is an author at City University of Hong Kong specializing in engineering, materials science, and electronic packaging.

Top concepts

Publications per year

1996–2004

6

Publications

6

Growth kinetic studies of Cu–Sn intermetallic compound and its effect on shear strength of LCCC SMT solder joints

Y.C. Chan, A.C.K. So, J.K.L. Lai · Materials Science and Engineering B · 1998 · 164 citations

, , +7

Reliability studies of surface mount solder joints - effect of Cu-Sn intermetallic compounds

A.C.K. So, Y.C. Chan · IEEE Transactions on Components Packaging and Manufacturing Technology Part B · 1996 · 87 citations

, , +17

Effect of intermetallic compounds on the shear fatigue of Cu/63Sn-37Pb solder joints

Y.C. Chan, P.L. Tu, A.C.K. So et al. · IEEE Transactions on Components Packaging and Manufacturing Technology Part B · 1997 · 67 citations

, , +17

Aging studies of Cu-Sn intermetallic compounds in annealed surface mount solder joints

A.C.K. So, Y. C. Chan, J.K.L. Lai · IEEE Transactions on Components Packaging and Manufacturing Technology Part B · 1997 · 57 citations

, , +15

Characterization of Kovar-to-Kovar laser welded joints and its mechanical strength

C.W. Tan, Y.C. Chan, Bernard Leung et al. · Optics and Lasers in Engineering · 2004 · 14 citations

, , +4

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