IEEE Transactions on Components Packaging and Manufacturing Technology Part B

Modeling and analysis of multichip module power supply planes

Keunmyung Lee, A. Barber · 1995 · 181 citations

Engineering, Electrical Engineering, Microelectronics +16

Interconnect and circuit modeling techniques for full-chip power supply noise analysis

H.H. Chen, J.S. Neely · 1998 · 172 citations

Engineering, Computer Engineering, Electrical Engineering +17

Analysis of the flow of encapsulant during underfill encapsulation of flip-chips

Sejin Han, K.K. Wang · 1997 · 158 citations

Engineering, Materials Engineering, Materials Science +13

Anisotropically conductive adhesive flip-chip bonding on rigid and flexible printed circuit substrates

Zonghe Lai, Johan Liu · 1996 · 156 citations

Engineering, Materials Engineering, Materials Science +17

Effect of intermetallic compounds on the thermal fatigue of surface mount solder joints

P.L. Tu, Y.C. Chan, J.K.L. Lai · 1997 · 150 citations

Natural Sciences, Materials Engineering, Materials Science +17