Concepedia

K.K. Wang

KW

7

Publications

652

Citations

7

H-Index

1983

Active since

Affiliations

Cornell University(Current)

K.K. Wang is an author at Cornell University specializing in engineering, mechanical engineering, and materials science.

Top concepts

EngineeringMechanical EngineeringMaterial ScienceHeat TransferMicroelectronicsThermal EngineeringElectronic PackagingApplied PhysicsMicrofabricationSystems Engineering

Publications per year

1983–2000

7

Publications

7

Geometric Modeling for Swept Volume of Moving Solids

W.p. Wang, K.K. Wang · IEEE Computer Graphics and Applications · 1986 · 334 citations

Engineering, Mechanical Engineering, Swept Voume +20

Analysis of the flow of encapsulant during underfill encapsulation of flip-chips

Sejin Han, K.K. Wang · IEEE Transactions on Components Packaging and Manufacturing Technology Part B · 1997 · 156 citations

Engineering, Liquid-liquid Flow, Fluid Mechanics +21

The Effect of Tool Flank Wear on the Heat Transfer, Thermal Damage and Cutting Mechanics in Finish Hard Tuning

J.Y. Wang, C.R. Liu, K.K. Wang · CIRP Annals · 1999 · 71 citations

Materials Science, Engineering, Material Machining +12

Modelling of Cutting Force Pulsation in Face-Milling

Zhou Ruzhong, K.K. Wang, E. Merchant · CIRP Annals · 1983 · 33 citations

Engineering, Mechanics, Material Machining +6

Study on the pressurized underfill encapsulation of flip chips

Sejin Han, K.K. Wang · IEEE Transactions on Components Packaging and Manufacturing Technology Part B · 1997 · 32 citations

Materials Science, Engineering, Advanced Packaging (Semiconductors) +14

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