Concepedia

Sejin Han

SH

7

Publications

308

Citations

7

H-Index

1995

Active since

Affiliations

Cornell University(Current)

Sejin Han is an author at Cornell University specializing in engineering, materials science, and mechanical engineering.

Top concepts

EngineeringMaterial ScienceMechanical EngineeringMicroelectronicsElectronic PackagingHeat TransferApplied PhysicsMicrofabricationRheologyFluid Dynamics

Publications per year

1995–2019

7

Publications

7

Analysis of the flow of encapsulant during underfill encapsulation of flip-chips

Sejin Han, K.K. Wang · IEEE Transactions on Components Packaging and Manufacturing Technology Part B · 1997 · 156 citations

Engineering, Liquid-liquid Flow, Fluid Mechanics +21

Finite-Element Analysis of Lamb Wave Propagation in a Thin Aluminum Plate

Sejin Han, Anthony N. Palazotto, Charles L. Leakeas · Journal of Aerospace Engineering · 2009 · 42 citations

Study on the pressurized underfill encapsulation of flip chips

Sejin Han, K.K. Wang · IEEE Transactions on Components Packaging and Manufacturing Technology Part B · 1997 · 32 citations

Materials Science, Engineering, Advanced Packaging (Semiconductors) +14

A Study on Wire Sweep in Encapsulation of Semiconductor Chips Using Simulated Experiments

Sejin Han, K. K. Wang · Journal of Electronic Packaging · 1995 · 29 citations

Transfer Molding, Engineering, Mechanical Engineering +17

Characterization of the rheological properties of a fast-curing epoxy-molding compound

Sejin Han, K. K. Wang, C. A. Hieber et al. · Journal of Rheology · 1997 · 19 citations

Engineering, Fluid Mechanics, Mechanical Engineering +17

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