Concepedia

Keunmyung Lee

KL

Statistics

Publications

3

Citations

246

H-Index

3

Active since

1994

Affiliations

Hewlett-Packard (United States)(Current)

Keunmyung Lee is an author at Hewlett-Packard (United States) specializing in electronic packaging, computer engineering, and engineering.

Top concepts

Publications per year

1994–1999

3

Publications

3

Modeling and analysis of multichip module power supply planes

Keunmyung Lee, A. Barber · IEEE Transactions on Components Packaging and Manufacturing Technology Part B · 1995 · 181 citations

, , +16

Accurate power supply and ground plane pair models [for MCMs]

Hengtian Wu, Jeff Meyer, Keunmyung Lee et al. · IEEE Transactions on Advanced Packaging · 1999 · 50 citations

, , +14

A bare-chip probe for high I/O, high speed testing

A. Barber, Keunmyung Lee, H. Obermaier · IEEE Transactions on Components Packaging and Manufacturing Technology Part B · 1994 · 15 citations

, , +16

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