Y.C. Chan

Failure mechanisms of solder interconnects under current stressing in advanced electronic packages

Y.C. Chan, Daoguo Yang · Progress in Materials Science · 2010 · 271 citations

Electrical Engineering, Reliability Engineering, Engineering +11

Research advances in nano-composite solders

Jun Shen, Y.C. Chan · Microelectronics Reliability · 2008 · 229 citations

Materials Science, Engineering, Research Advances +3

Investigations of interfacial reactions of Sn–Zn based and Sn–Ag–Cu lead-free solder alloys as replacement for Sn–Pb solder

Mobinul Islam, Y.C. Chan, M.J. Rizvi et al. · Journal of Alloys and Compounds · 2005 · 145 citations

Materials Engineering, Materials Science, Sn–pb Solder +7

Growth kinetics of intermetallic compounds in chip scale package solder joint

P.L. Tu, Y.C. Chan, K.C. Hung et al. · Scripta Materialia · 2001 · 139 citations

Materials Engineering, Materials Science, Chip-scale Package +10

Fast response resistive humidity sensitivity of polyimide/multiwall carbon nanotube composite films

Qingyuan Tang, Y.C. Chan, Kaili Zhang · Sensors and Actuators B Chemical · 2010 · 135 citations

Materials Science, Engineering, Carbon-based Material +7