Y.C. Chan - Concepedia

Author

Y.C. Chan

City University of Hong Kong

Also Known As

Y C Chan, Y. C. Chan, Y. Chan, Y.C Chan, Y.C. Chan, Yun-Shuo Chan

213

Publications

5.5K

Citations

H-Index

Concepts

All Affiliations

City University of Hong Kong Huazhong University of Science and Technology Hong Kong Polytechnic University University of Greenwich University of California, Los Angeles

About

Y.C. Chan is an author at City University of Hong Kong specializing in engineering, materials science, and applied physics.

Top Concepts

#	Concept	H-Index	Publications	Citations
1	Engineering	42	114	5.1K
2	Applied Physics	28	51	2.2K
3	Chemical Engineering	11	12	402
4	Chemistry	4	4	176
5	Computer Engineering	1	1	33

Y.C. Chan

122

Publications

5.3K

Citations

H-Index

Page 1

	Year	Citations
Failure mechanisms of solder interconnects under current stressing in advanced electronic packages Y.C. Chan, Daoguo Yang Progress in Materials Science Electrical EngineeringReliability EngineeringEngineeringAdvanced Packaging (Semiconductors)Hardware Reliability	2010	271
Research advances in nano-composite solders Jun Shen, Y.C. Chan Microelectronics Reliability Materials ScienceEngineeringResearch AdvancesNanomaterialsNanocomposite	2008	229
Investigations of interfacial reactions of Sn–Zn based and Sn–Ag–Cu lead-free solder alloys as replacement for Sn–Pb solder Mobinul Islam, Y.C. Chan, M.J. Rizvi, Journal of Alloys and Compounds Materials EngineeringMaterials ScienceSn–pb SolderInterfacial ReactionsEngineering	2005	145
Growth kinetics of intermetallic compounds in chip scale package solder joint P.L. Tu, Y.C. Chan, K.C. Hung, Scripta Materialia Materials EngineeringMaterials ScienceChip-scale PackageEngineeringIntermetallic Compounds	2001	139
Fast response resistive humidity sensitivity of polyimide/multiwall carbon nanotube composite films Qingyuan Tang, Y.C. Chan, Kaili Zhang Sensors and Actuators B Chemical Materials ScienceEngineeringCarbon-based MaterialNanomaterialsComposite Technology	2010	135
Investigations on microhardness of Sn–Zn based lead-free solder alloys as replacement of Sn–Pb solder Rashed Adnan Islam, Bin Wu, M.O. Alam, Journal of Alloys and Compounds Materials EngineeringMaterials ScienceSn–pb SolderEngineeringMechanical Engineering	2005	129
Microstructures and properties of new Sn–Ag–Cu lead-free solder reinforced with Ni-coated graphene nanosheets Guang Chen, Fengshun Wu, Changqing Liu, Journal of Alloys and Compounds Materials ScienceNanosheetEngineeringCarbon-based MaterialNanomaterials	2015	128
Effect of additions of ZrO2 nano-particles on the microstructure and shear strength of Sn–Ag–Cu solder on Au/Ni metallized Cu pads Asit Kumar Gain, Y.C. Chan, K.C. Yung Microelectronics Reliability Materials ScienceMaterials EngineeringEngineeringNanomaterialsApplied Physics	2011	117
Effect of reaction time and P content on mechanical strength of the interface formed between eutectic Sn–Ag solder and Au/electroless Ni(P)/Cu bond pad M.O. Alam, Y.C. Chan, K. N. Tu Journal of Applied Physics EngineeringMechanical EngineeringReaction TimeStructural MaterialsShear Strengths	2003	111
Adhesion strength and contact resistance of flip chip on flex packages––effect of curing degree of anisotropic conductive film Mohammad Afsar Uddin, M.O. Alam, Y.C. Chan, Microelectronics Reliability Materials ScienceFlip ChipChip-scale PackageEngineeringMicrofabrication	2003	100

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