M.J. Rizvi - Concepedia

Author

M.J. Rizvi

University of Greenwich ORCID

Also Known As

M. J. Rizvi, M. Jahir Rizvi, M. Rizvi, M.J. Rizvi, Md Jahir Rizvi, Md Rizvi

Publications

1.1K

Citations

H-Index

Concepts

All Affiliations

University of Greenwich City University of Hong Kong University of Plymouth

About

M.J. Rizvi is an author at University of Greenwich specializing in engineering, materials science, and mechanical engineering.

Top Concepts

#	Concept	H-Index	Publications	Citations
1	Engineering	16	20	987
2	Applied Physics	7	7	300
3	Materials Engineering	7	7	463
4	Electrical Engineering	2	2	24
5	Chemical Engineering	1	1	48

M.J. Rizvi

Publications

Citations

H-Index

Page 1

	Year	Citations
Investigations of interfacial reactions of Sn–Zn based and Sn–Ag–Cu lead-free solder alloys as replacement for Sn–Pb solder Mobinul Islam, Y.C. Chan, M.J. Rizvi, Journal of Alloys and Compounds Materials EngineeringMaterials ScienceSn–pb SolderInterfacial ReactionsEngineering	2005	145
Effects of hygrothermal stress on the failure of CFRP composites M.J. Rizvi, Stephen Grove, Huirong Le Composite Structures Materials ScienceFibre-reinforced PlasticEngineeringMechanical EngineeringComposite Technology	2015	113
Effect of adding 1wt% Bi into the Sn–2.8Ag–0.5Cu solder alloy on the intermetallic formations with Cu-substrate during soldering and isothermal aging M.J. Rizvi, Yin‐Ching Chan, C. Bailey, Journal of Alloys and Compounds Materials ScienceMaterials EngineeringIntermetallic FormationsEngineeringApplied Physics	2005	89
3D FEA modelling of laminated composites in bending and their failure mechanisms Huirong Le, M.J. Rizvi, Stephen Grove Composite Structures Materials ScienceFibre-reinforced PlasticEngineeringLaminated CompositesMechanical Engineering	2014	75
Multi-scale modelling of moisture diffusion coupled with stress distribution in CFRP laminated composites M.J. Rizvi, Huirong Le, Stephen Grove Composite Structures Stress DistributionMoisture DiffusionEngineeringFibre-reinforced PlasticMechanics	2015	72
Effect of adding 0.3wt% Ni into the Sn–0.7wt% Cu solder M.J. Rizvi, C. Bailey, Y. C. Chan, Journal of Alloys and Compounds Materials EngineeringMaterials ScienceEngineeringApplied PhysicsMetallurgical Interaction	2006	60
Dissolution of electroless Ni metallization by lead-free solder alloys Ahmed Sharif, Y.C. Chan, Mobinul Islam, Journal of Alloys and Compounds Materials ScienceMaterials EngineeringEngineeringCorrosionMetallurgical Interaction	2004	55
Moisture effects on the bending fatigue of laminated composites Maozhou Meng, Huirong Le, Stephen Grove, Composite Structures Materials ScienceEngineeringLaminated CompositesMechanical EngineeringContinuous-fibre Composite	2016	51
The effects of unequal compressive/tensile moduli of composites Huirong Le, M.J. Rizvi, Stephen Grove Composite Structures Materials ScienceEngineeringMechanical EngineeringComposite TechnologyCompression (Physics)	2015	49
Wetting and reaction of Sn-2.8Ag-0.5Cu-1.0Bi solder with Cu and Ni substrates M.J. Rizvi, Y.C. Chan, C. Bailey, Journal of Electronic Materials Materials ScienceMaterials EngineeringChemical EngineeringEngineeringCorrosion	2005	48

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