Effect of adding 1wt% Bi into the Sn–2.8Ag–0.5Cu solder alloy on the intermetallic formations with Cu-substrate during soldering and isothermal aging

Six cases of reliability study of Pb-free solder joints in electronic packaging technology

Ke Zeng, K. N. Tu · Materials Science and Engineering R Reports · 2002 · 1.3K citations

Reliability, Electrical Engineering, Reliability Engineering +10

Morphology, kinetics, and thermodynamics of solid-state aging of eutectic SnPb and Pb-free solders (Sn–3.5Ag, Sn–3.8Ag–0.7Cu and Sn–0.7Cu) on Cu

T. Y. Lee, Woon‐Seop Choi, K. N. Tu et al. · Journal of materials research/Pratt's guide to venture capital sources · 2002 · 252 citations

Materials Science, Engineering, Pb-free Solders +8

Influence of Bi on microstructures evolution and mechanical properties in Sn–Ag–Cu lead-free solder

Jie Zhao, Lin Qi, Xiumin Wang et al. · Journal of Alloys and Compounds · 2004 · 179 citations

Materials Science, Materials Engineering, Engineering +7

Growth kinetics of intermetallic compounds in chip scale package solder joint

P.L. Tu, Y.C. Chan, K.C. Hung et al. · Scripta Materialia · 2001 · 139 citations

Materials Engineering, Materials Science, Chip-scale Package +10

Properties of ternary Sn-Ag-Bi solder alloys: Part I—Thermal properties and microstructural analysis

Paul T. Vianco, Jerome A. Rejent · Journal of Electronic Materials · 1999 · 137 citations

Materials Science, Materials Engineering, Part I—thermal Properties +7