Effect of adding 1wt% Bi into the Sn–2.8Ag–0.5Cu solder alloy on the intermetallic formations with Cu-substrate during soldering and isothermal aging

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Morphology, kinetics, and thermodynamics of solid-state aging of eutectic SnPb and Pb-free solders (Sn–3.5Ag, Sn–3.8Ag–0.7Cu and Sn–0.7Cu) on Cu

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Influence of Bi on microstructures evolution and mechanical properties in Sn–Ag–Cu lead-free solder

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Natural Sciences, Materials Engineering, Materials Science +14

Growth kinetics of intermetallic compounds in chip scale package solder joint

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Properties of ternary Sn-Ag-Bi solder alloys: Part I—Thermal properties and microstructural analysis

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