T. Y. Lee

Morphology, kinetics, and thermodynamics of solid-state aging of eutectic SnPb and Pb-free solders (Sn–3.5Ag, Sn–3.8Ag–0.7Cu and Sn–0.7Cu) on Cu

T. Y. Lee, Woon‐Seop Choi, K. N. Tu et al. · Journal of materials research/Pratt's guide to venture capital sources · 2002 · 253 citations

Natural Sciences, Materials Engineering, Materials Science +13

Direct correlation between microstructure and mechanical tensile properties in Pb-free solders and eutectic SnPb solder for flip chip technology

Jin‐Wook Jang, A. P. De Silva, T. Y. Lee et al. · Applied Physics Letters · 2001 · 30 citations

Natural Sciences, Materials Engineering, Materials Science +17

Mesenteric cystic lymphangioma with myxoid degeneration: Unusual CT and MR manifestations

Sheung-Fat Ko, Shu‐Hang Ng, Chie‐Song Shieh et al. · Pediatric Radiology · 1995 · 27 citations

Medicine, Pathology, Radiology +9