Publication | Closed Access

Morphology, kinetics, and thermodynamics of solid-state aging of eutectic SnPb and Pb-free solders (Sn–3.5Ag, Sn–3.8Ag–0.7Cu and Sn–0.7Cu) on Cu

Materials ScienceEngineeringPb-free SoldersApplied PhysicsMetallurgical InteractionMaterial PerformanceEutectic SnpbChemistryElectronic PackagingSolid-state AgingMicrostructure