D. R. Frear - Concepedia

Author

D. R. Frear

Also Known As

D Frear, D. Frear, D. R. Frear, D.R. Frear, Darrel Frear, Darrel R Frear, Darrel R. Frear, Darrel Richard Frear, Frear, D. R., Frear, D.R.; Burchett, S.N. [Sandia National Labs., Albuquerque, NM (United States)]; Rashid, M.M. [California Univ., Davis, CA (United States)]

144

Publications

5.3K

Citations

H-Index

Concepts

All Affiliations

Sandia National Laboratories Motorola (United States)Lawrence Berkeley National Laboratory University of California, Berkeley University of California, Los Angeles

About

D. R. Frear is an author at Sandia National Laboratories specializing in engineering, materials science, and microstructure.

Top Concepts

#	Concept	H-Index	Publications	Citations
1	Engineering	36	58	4K
2	Applied Physics	17	23	1.7K
3	Chemistry	5	5	458
4	Chemical Engineering	2	2	250
5	Natural Sciences	1	1	20

D. R. Frear

Publications

4.3K

Citations

H-Index

Page 1

	Year	Citations
Pb-free solders for flip-chip interconnects D. R. Frear, Jihun Jang, J. K. Lin, JOM Electrical EngineeringEngineeringAdvanced Packaging (Semiconductors)Pb-free SoldersChip On Board	2001	316
Solder reaction-assisted crystallization of electroless Ni–P under bump metallization in low cost flip chip technology Jihun Jang, P. G. Kim, K. N. Tu, Journal of Applied Physics EngineeringCrystal Growth TechnologySolid-state ChemistrySolder Reaction-assisted CrystallizationBump Metallization	1999	282
Intermetallic growth and mechanical behavior of low and high melting temperature solder alloys D. R. Frear, Paul T. Vianco Metallurgical and Materials Transactions A Materials ScienceMaterials EngineeringEngineeringMechanical BehaviorMechanical Engineering	1994	274
Morphology, kinetics, and thermodynamics of solid-state aging of eutectic SnPb and Pb-free solders (Sn–3.5Ag, Sn–3.8Ag–0.7Cu and Sn–0.7Cu) on Cu T. Y. Lee, Woon‐Seop Choi, K. N. Tu, Journal of materials research/Pratt's guide to venture capital sources Materials ScienceEngineeringPb-free SoldersApplied PhysicsMetallurgical Interaction	2002	252
Electromigration of eutectic SnPb and SnAg3.8Cu0.7 flip chip solder bumps and under-bump metallization T. Y. Lee, K. N. Tu, D. R. Frear Journal of Applied Physics Materials EngineeringMaterials ScienceElectrical EngineeringElectromigration TechniqueEngineering	2001	226
Morphology of interfacial reaction between lead-free solders and electroless Ni–P under bump metallization Jihun Jang, D. R. Frear, T. Y. Lee, Journal of Applied Physics EngineeringBump MetallizationSolid StateElectrometallurgyChemical Engineering	2000	191
Issues in the replacement of lead-bearing solders Paul T. Vianco, D. R. Frear JOM Defect ToleranceLead-bearing SoldersLead Identification	1993	190
Electromigration of eutectic SnPb solder interconnects for flip chip technology T. Y. Lee, K. N. Tu, S.-M. Kuo, Journal of Applied Physics Materials ScienceAdvanced PackagingElectrical EngineeringFlip Chip TechnologyEngineering	2001	181
A microstructural study of the thermal fatigue failures of 60sn-40Pb solder joints D. R. Frear, D. Grivas, J. W. Morris Journal of Electronic Materials Materials ScienceEngineeringThermal Fatigue Failures60Sn-40pb Solder JointsHardware Reliability	1988	135
Electron microscopy study of interfacial reaction between eutectic SnPb and Cu/Ni(V)/Al thin film metallization C. Y. Liu, K. N. Tu, T. T. Sheng, Journal of Applied Physics Aluminium NitrideEngineeringThin Film Process TechnologyChemical DepositionElectron Microscopy	2000	117

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