D. R. Frear

Pb-free solders for flip-chip interconnects

D. R. Frear, Jihun Jang, J. K. Lin et al. · JOM · 2001 · 316 citations

Electrical Engineering, Engineering, Advanced Packaging (Semiconductors) +5

Solder reaction-assisted crystallization of electroless Ni–P under bump metallization in low cost flip chip technology

Jihun Jang, P. G. Kim, K. N. Tu et al. · Journal of Applied Physics · 1999 · 282 citations

Engineering, Crystal Growth Technology, Solid-state Chemistry +17

Intermetallic growth and mechanical behavior of low and high melting temperature solder alloys

D. R. Frear, Paul T. Vianco · Metallurgical and Materials Transactions A · 1994 · 274 citations

Materials Science, Materials Engineering, Engineering +10

Morphology, kinetics, and thermodynamics of solid-state aging of eutectic SnPb and Pb-free solders (Sn–3.5Ag, Sn–3.8Ag–0.7Cu and Sn–0.7Cu) on Cu

T. Y. Lee, Woon‐Seop Choi, K. N. Tu et al. · Journal of materials research/Pratt's guide to venture capital sources · 2002 · 252 citations

Materials Science, Engineering, Pb-free Solders +8

Electromigration of eutectic SnPb and SnAg3.8Cu0.7 flip chip solder bumps and under-bump metallization

T. Y. Lee, K. N. Tu, D. R. Frear · Journal of Applied Physics · 2001 · 226 citations

Materials Engineering, Materials Science, Electrical Engineering +15