Concepedia

P. G. Kim

PG

6

Publications

518

Citations

6

H-Index

1996

Active since

Affiliations

University of California, Los Angeles(Current)

Hodges University

Semiconductor Manufacturing International (Italy)

Texas Instruments (United States)

Motorola (United States)

P. G. Kim is an author at University of California, Los Angeles specializing in engineering, electronic packaging, and materials science.

Top concepts

EngineeringMaterial ScienceElectronic PackagingSurface ScienceMicrostructureMaterials EngineeringThin FilmsSolidificationApplied PhysicsChemistry

Publications per year

1996–2000

6

Publications

6

Solder reaction-assisted crystallization of electroless Ni–P under bump metallization in low cost flip chip technology

Jihun Jang, P. G. Kim, K. N. Tu et al. · Journal of Applied Physics · 1999 · 282 citations

Engineering, Crystal Growth Technology, Solid-state Chemistry +17

Fast dissolution and soldering reactions on Au foils

P. G. Kim, K. N. Tu · Materials Chemistry and Physics · 1998 · 87 citations

Materials Science, Engineering, Material Processing +6

Morphology of wetting reaction of eutectic SnPb solder on Au foils

P. G. Kim, K. N. Tu · Journal of Applied Physics · 1996 · 75 citations

Materials Engineering, Materials Science, Chemical Engineering +14

Interfacial Morphology and Shear Deformation of Flip Chip Solder Joints

Jihun Jang, C. Y. Liu, P. G. Kim et al. · Journal of materials research/Pratt's guide to venture capital sources · 2000 · 33 citations

Materials Science, Friction Welding, Engineering +10

Time- and temperature-dependent wetting behavior of eutectic SnPb on Cu leadframes plated with Pd/Ni and Au/Pd/Ni thin films

P. G. Kim, K. N. Tu, D.C. Abbott · Journal of Applied Physics · 1998 · 29 citations

Engineering, Surface Nanotechnology, Chemical Deposition +17

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