P. G. Kim - Concepedia

Author

P. G. Kim

Also Known As

P. G. Kim, P.G. Kim, Poongyeon Kim

Publications

523

Citations

H-Index

Concepts

All Affiliations

P. G. Kim is an author at University of California, Los Angeles specializing in engineering, electronic packaging, and materials science.

#	Concept	H-Index	Publications	Citations
1	Engineering	6	6	518
2	Applied Physics	3	3	323
3	Chemistry	2	2	87
4	Chemical Engineering	1	1	75
5	Electrical Engineering	1	1	282

P. G. Kim

Publications

518

Citations

H-Index

Page 1

	Year	Citations
Solder reaction-assisted crystallization of electroless Ni–P under bump metallization in low cost flip chip technology Jihun Jang, P. G. Kim, K. N. Tu, Journal of Applied Physics EngineeringCrystal Growth TechnologySolid-state ChemistrySolder Reaction-assisted CrystallizationBump Metallization	1999	282
Fast dissolution and soldering reactions on Au foils P. G. Kim, K. N. Tu Materials Chemistry and Physics Materials ScienceEngineeringMaterial ProcessingCorrosionSurface Science	1998	87
Morphology of wetting reaction of eutectic SnPb solder on Au foils P. G. Kim, K. N. Tu Journal of Applied Physics Materials EngineeringMaterials ScienceChemical EngineeringEngineeringElectron Microscopy	1996	75
Interfacial Morphology and Shear Deformation of Flip Chip Solder Joints Jihun Jang, C. Y. Liu, P. G. Kim, Journal of materials research/Pratt's guide to venture capital sources Materials ScienceFriction WeldingEngineeringMechanicsChip On Board	2000	33
Time- and temperature-dependent wetting behavior of eutectic SnPb on Cu leadframes plated with Pd/Ni and Au/Pd/Ni thin films P. G. Kim, K. N. Tu, D.C. Abbott Journal of Applied Physics EngineeringSurface NanotechnologyChemical DepositionWetting TimeAu/pd/ni Thin Films	1998	29
Soldering reaction between eutectic SnPb and plated Pd/Ni thin films on Cu leadframe P. G. Kim, K. N. Tu, D.C. Abbott Applied Physics Letters EngineeringChemistryGrowth RateSoldering ReactionElectronic Packaging	1997	12

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