Jihun Jang

Pb-free solders for flip-chip interconnects

D. R. Frear, Jihun Jang, J. K. Lin et al. · JOM · 2001 · 316 citations

Electrical Engineering, Engineering, Advanced Packaging (Semiconductors) +5

Solder reaction-assisted crystallization of electroless Ni–P under bump metallization in low cost flip chip technology

Jihun Jang, P. G. Kim, K. N. Tu et al. · Journal of Applied Physics · 1999 · 282 citations

Engineering, Crystal Growth Technology, Solid-state Chemistry +17

Morphology of interfacial reaction between lead-free solders and electroless Ni–P under bump metallization

Jihun Jang, D. R. Frear, T. Y. Lee et al. · Journal of Applied Physics · 2000 · 191 citations

Engineering, Bump Metallization, Solid State +16

Solid-state annealing behavior of two high-Pb solders, 95Pb5Sn and 90Pb10Sn, on Cu under bump metallurgy

Lakshmi N. Ramanathan, Jihun Jang, J. K. Lin et al. · Journal of Electronic Materials · 2005 · 38 citations

Materials Science, Materials Engineering, Electrical Engineering +8

Design and Fabrication of Double-Focused Ultrasound Transducers to Achieve Tight Focusing

Jihun Jang, Jin Ho Chang · Sensors · 2016 · 35 citations · Full text