Concepedia

T. Y. Lee

TY

8

Publications

1K

Citations

8

H-Index

2000

Active since

Affiliations

University of California, Los Angeles(Current)

Hodges University

Semiconductor Manufacturing International (Italy)

Motorola (United States)

T. Y. Lee is an author at University of California, Los Angeles specializing in engineering, materials science, and microstructure.

Top concepts

EngineeringMaterial ScienceMicrostructureApplied PhysicsMaterials EngineeringSurface ScienceMicroelectronicsElectronic PackagingElectrical EngineeringSolidification

Publications per year

2000–2013

8

Publications

8

Electromigration of eutectic SnPb and SnAg3.8Cu0.7 flip chip solder bumps and under-bump metallization

T. Y. Lee, K. N. Tu, D. R. Frear · Journal of Applied Physics · 2001 · 226 citations

Materials Engineering, Materials Science, Electrical Engineering +15

Morphology of interfacial reaction between lead-free solders and electroless Ni–P under bump metallization

Jihun Jang, D. R. Frear, T. Y. Lee et al. · Journal of Applied Physics · 2000 · 191 citations

Engineering, Bump Metallization, Solid State +16

Electromigration of eutectic SnPb solder interconnects for flip chip technology

T. Y. Lee, K. N. Tu, S.-M. Kuo et al. · Journal of Applied Physics · 2001 · 181 citations

Materials Science, Advanced Packaging, Electrical Engineering +15

Tin whiskers studied by synchrotron radiation scanning X-ray micro-diffraction

Woon‐Seop Choi, T. Y. Lee, K. N. Tu et al. · Acta Materialia · 2003 · 167 citations

Materials Science, Engineering, Surface Science +6

Wetting reaction versus solid state aging of eutectic SnPb on Cu

K. N. Tu, T. Y. Lee, J. W. Jang et al. · Journal of Applied Physics · 2001 · 116 citations

Engineering, Wetting Reaction, Solid-state Chemistry +17

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