T. Y. Lee - Concepedia

Author

T. Y. Lee

University of California, Los Angeles

Also Known As

T. Y. Lee, T.Y. Lee, Thatcher Lee, Tsz Ying (Amy) Lee

Publications

Citations

H-Index

Concepts

All Affiliations

University of California, Los Angeles Hodges University Semiconductor Manufacturing International (Italy)Motorola (United States)

About

T. Y. Lee is an author at University of California, Los Angeles specializing in engineering, materials science, and microstructure.

Top Concepts

#	Concept	H-Index	Publications	Citations
1	Engineering	7	7	944
2	Applied Physics	4	4	586
3	Medicine	1	1	81
4	Allergy	1	1	81
5	Biochemistry	1	1	81

T. Y. Lee

Publications

Citations

H-Index

Page 1

	Year	Citations
Electromigration of eutectic SnPb and SnAg3.8Cu0.7 flip chip solder bumps and under-bump metallization T. Y. Lee, K. N. Tu, D. R. Frear Journal of Applied Physics Materials EngineeringMaterials ScienceElectrical EngineeringElectromigration TechniqueEngineering	2001	226
Morphology of interfacial reaction between lead-free solders and electroless Ni–P under bump metallization Jihun Jang, D. R. Frear, T. Y. Lee, Journal of Applied Physics EngineeringBump MetallizationSolid StateElectrometallurgyChemical Engineering	2000	191
Electromigration of eutectic SnPb solder interconnects for flip chip technology T. Y. Lee, K. N. Tu, S.-M. Kuo, Journal of Applied Physics Materials ScienceAdvanced PackagingElectrical EngineeringFlip Chip TechnologyEngineering	2001	181
Tin whiskers studied by synchrotron radiation scanning X-ray micro-diffraction Woon‐Seop Choi, T. Y. Lee, K. N. Tu, Acta Materialia Materials ScienceEngineeringSurface ScienceApplied PhysicsTin Whiskers	2003	167
Wetting reaction versus solid state aging of eutectic SnPb on Cu K. N. Tu, T. Y. Lee, J. W. Jang, Journal of Applied Physics EngineeringWetting ReactionSolid-state ChemistryChemistryChemical Deposition	2001	116
Sulforaphane-rich broccoli sprout extract attenuates nasal allergic response to diesel exhaust particles David Heber, Zhaoping Li, Maria Garcia-Lloret, Food & Function AsthmaInflammatory Lung DiseaseLung InflammationLipid PeroxidationAllergen	2013	81
Morphological stability of solder reaction products in flip chip technology K. N. Tu, Fiona Ku, T. Y. Lee Journal of Electronic Materials Materials ScienceMaterials EngineeringFlip Chip TechnologyEngineeringAdvanced Packaging (Semiconductors)	2001	51
Study of grass formation in GaAs backside via etching using inductively coupled plasma system Peter Nam, Licínio M. Gando‐Ferreira, T. Y. Lee, Journal of Vacuum Science & Technology B Microelectronics and Nanometer Structures Processing Measurement and Phenomena Electrical EngineeringVertical GrassEngineeringSurface ScienceApplied Physics	2000	12

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