J. W. Jang

Morphology, kinetics, and thermodynamics of solid-state aging of eutectic SnPb and Pb-free solders (Sn–3.5Ag, Sn–3.8Ag–0.7Cu and Sn–0.7Cu) on Cu

T. Y. Lee, Woon‐Seop Choi, K. N. Tu et al. · Journal of materials research/Pratt's guide to venture capital sources · 2002 · 252 citations

Materials Science, Engineering, Pb-free Solders +8

Wetting reaction versus solid state aging of eutectic SnPb on Cu

K. N. Tu, T. Y. Lee, J. W. Jang et al. · Journal of Applied Physics · 2001 · 116 citations

Engineering, Wetting Reaction, Solid-state Chemistry +17

High-temperature lead-free SnSb solders: Wetting reactions on Cu foils and phased-in Cu–Cr thin films

J. W. Jang, P. G. Kim, K. N. Tu et al. · Journal of materials research/Pratt's guide to venture capital sources · 1999 · 51 citations

Materials Science, Materials Engineering, Cu Foils +6

Low-firing and microwave dielectric properties of Ba[(Ni0.6Zn0.4)0 .33Nb0.67]O3 ceramics doped with Sb2O5 and B2O3

J. H. Lee, Young-Ho Jang, H. J. Youn et al. · Journal of Materials Science · 1999 · 15 citations

Secondary Current Crowding Effect during Electromigration of Flip-Chip Solder Joints

J. W. Jang, Lakshmi N. Ramanathan, J. Tang et al. · Journal of Electronic Materials · 2007 · 11 citations

Electrical Engineering, Electromigration Technique, Engineering +6