Concepedia

Woon‐Seop Choi

WC

40

Publications

3K

Citations

24

H-Index

2001

Active since

Affiliations

Hoseo University(Current)

University of California, Los Angeles

Pohang University of Science and Technology

Hodges University

Semiconductor Manufacturing International (Italy)

Woon‐Seop Choi is an author at Hoseo University specializing in engineering, applied physics, and materials science.

Top concepts

EngineeringMaterial ScienceApplied PhysicsElectrical EngineeringElectronic PackagingThin FilmsSurface ScienceMicroelectronicsElectronic DevicesMaterials Engineering

Publications per year

2001–2022

40

Publications

40

Materials and Optimized Designs for Human‐Machine Interfaces Via Epidermal Electronics

Jae Woong Jeong, Woon‐Hong Yeo, Aadeel Akhtar et al. · Advanced Materials · 2013 · 805 citations · Full text

Current-crowding-induced electromigration failure in flip chip solder joints

Everett C. C. Yeh, Woon‐Seop Choi, K. N. Tu et al. · Applied Physics Letters · 2002 · 361 citations

Electrical Engineering, Electromigration Technique, Engineering +12

Morphology, kinetics, and thermodynamics of solid-state aging of eutectic SnPb and Pb-free solders (Sn–3.5Ag, Sn–3.8Ag–0.7Cu and Sn–0.7Cu) on Cu

T. Y. Lee, Woon‐Seop Choi, K. N. Tu et al. · Journal of materials research/Pratt's guide to venture capital sources · 2002 · 252 citations

Materials Science, Engineering, Pb-free Solders +8

Mean-time-to-failure study of flip chip solder joints on Cu/Ni(V)/Al thin-film under-bump-metallization

Woon‐Seop Choi, Everett C. C. Yeh, K. N. Tu · Journal of Applied Physics · 2003 · 231 citations

Engineering, Mean-time-to-failure Study, Solder Bump +18

Tin whiskers studied by synchrotron radiation scanning X-ray micro-diffraction

Woon‐Seop Choi, T. Y. Lee, K. N. Tu et al. · Acta Materialia · 2003 · 167 citations

Materials Science, Engineering, Surface Science +6

Rows per page

1–5 of 40