Everett C. C. Yeh

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Active since

1997

Affiliations

University of California, Los Angeles(Current)

Semiconductor Manufacturing International (Italy)

Hodges University

Powertech Technology (Taiwan)

National Tsing Hua University

Everett C. C. Yeh is an author at University of California, Los Angeles specializing in electrical engineering, electronic materials, and semiconductor devices.

Publications per year

1997–2006

Publications

Current-crowding-induced electromigration failure in flip chip solder joints

Everett C. C. Yeh, Woon‐Seop Choi, K. N. Tu et al. · Applied Physics Letters · 2002 · 363 citations

Engineering, Electrical Engineering, Materials Science +17

Universal recovery behavior of negative bias temperature instability [PMOSFETs]

S. Rangan, Neal Mielke, Everett C. C. Yeh · 2004 · 282 citations

Engineering, Electrical Engineering, Fault-tolerant Computing +16

Mean-time-to-failure study of flip chip solder joints on Cu/Ni(V)/Al thin-film under-bump-metallization

Woon‐Seop Choi, Everett C. C. Yeh, K. N. Tu · Journal of Applied Physics · 2003 · 232 citations

Engineering, Electrical Engineering, Materials Science +17

Numerical simulation of current crowding phenomena and their effects on electromigration in very large scale integration interconnects

Everett C. C. Yeh, K. N. Tu · Journal of Applied Physics · 2000 · 46 citations

Natural Sciences, Electrical Engineering, Physics +17

Electromigration of flip chip solder bump on Cu/Ni(V)/Al thin film under bump metallization

Woon‐Seop Choi, Everett C. C. Yeh, K. N. Tu et al. · 2003 · 39 citations

Engineering, Electrical Engineering, Materials Science +17

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