Concepedia

Everett C. C. Yeh

EC

Statistics

Publications

10

Citations

1K

H-Index

10

Active since

1997

Affiliations

University of California, Los Angeles(Current)

Semiconductor Manufacturing International (Italy)

Hodges University

Powertech Technology (Taiwan)

National Tsing Hua University

Everett C. C. Yeh is an author at University of California, Los Angeles specializing in engineering, microelectronics, and electrical engineering.

Top concepts

EngineeringMicroelectronicsElectrical EngineeringElectronic PackagingApplied PhysicsMaterial ScienceElectrical InsulationMaterials EngineeringSurface ScienceThin Films

Publications per year

1997–2006

10

Publications

10

Current-crowding-induced electromigration failure in flip chip solder joints

Everett C. C. Yeh, Woon‐Seop Choi, K. N. Tu et al. · Applied Physics Letters · 2002 · 361 citations

Electrical Engineering, Electromigration Technique, Engineering +12

Universal recovery behavior of negative bias temperature instability [PMOSFETs]

S. Rangan, Neal Mielke, Everett C. C. Yeh · 2004 · 281 citations

Device Modeling, Degradation Independent Recovery, Electrical Engineering +9

Mean-time-to-failure study of flip chip solder joints on Cu/Ni(V)/Al thin-film under-bump-metallization

Woon‐Seop Choi, Everett C. C. Yeh, K. N. Tu · Journal of Applied Physics · 2003 · 231 citations

Engineering, Mean-time-to-failure Study, Solder Bump +18

Numerical simulation of current crowding phenomena and their effects on electromigration in very large scale integration interconnects

Everett C. C. Yeh, K. N. Tu · Journal of Applied Physics · 2000 · 46 citations

Engineering, Severe Plastic Deformation, Line Width +21

Electromigration of flip chip solder bump on Cu/Ni(V)/Al thin film under bump metallization

Woon‐Seop Choi, Everett C. C. Yeh, K. N. Tu et al. · 2003 · 39 citations

Engineering, Bump Metallization, Solder Bump +16

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