K. N. Tu - Concepedia

Author

K. N. Tu

University of California, Los Angeles ORCID

Also Known As

Jaron D. Kuppers, K. N. Tu, K.-N. Tu, K.N Tu, K.N. Tu, Kairong Tu, Kebiao Tu, King-ning Tu

205

Publications

16.2K

Citations

H-Index

120

Concepts

All Affiliations

University of California, Los Angeles Hodges University Semiconductor Manufacturing International (Italy)IBM Research - Thomas J. Watson Research Center National Yang Ming Chiao Tung University

About

K. N. Tu is an author at University of California, Los Angeles specializing in engineering, materials science, and applied physics.

Top Concepts

#	Concept	H-Index	Publications	Citations
1	Engineering	57	126	15.3K
2	Applied Physics	51	101	11.6K
3	Chemistry	20	25	1.9K
4	Natural Sciences	9	9	837
5	Chemical Engineering	6	6	252

K. N. Tu

133

Publications

15.7K

Citations

H-Index

Page 1

	Year	Citations
Thin Films—Interdiffusion and Reactions J. M. Poate, K. N. Tu, Jean-Claude Mayor, Journal of The Electrochemical Society Materials ScienceThin Film PhysicsEngineeringSurface ScienceApplied Physics	1979	1.7K
Six cases of reliability study of Pb-free solder joints in electronic packaging technology Ke Zeng, K. N. Tu Materials Science and Engineering R Reports ReliabilityElectrical EngineeringReliability EngineeringEngineeringReliability Study	2002	1.3K
Recent advances on electromigration in very-large-scale-integration of interconnects K. N. Tu Journal of Applied Physics Materials ScienceAdvanced PackagingElectrical EngineeringMm Si WafersMass Transport	2003	1.1K
Stress evolution due to electromigration in confined metal lines M. A. Korhonen, P. Bo rgesen, K. N. Tu, Journal of Applied Physics EngineeringBack StressesChip LevelIntegrated CircuitsStress Evolution	1993	724
Reliability challenges in 3D IC packaging technology K. N. Tu Microelectronics Reliability Reliability3D Ic ArchitectureChip-scale PackageEngineeringAdvanced Packaging (Semiconductors)	2010	622
Interdiffusion and reaction in bimetallic Cu-Sn thin films K. N. Tu Acta Metallurgica Materials EngineeringMaterials ScienceEngineeringSurface ScienceApplied Physics	1973	482
Current-crowding-induced electromigration failure in flip chip solder joints Everett C. C. Yeh, Woon‐Seop Choi, K. N. Tu, Applied Physics Letters Electrical EngineeringElectromigration TechniqueEngineeringAdvanced Packaging (Semiconductors)Microfabrication	2002	361
Irreversible processes of spontaneous whisker growth in bimetallic Cu-Sn thin-film reactions K. N. Tu Physical review. B, Condensed matter EngineeringSevere Plastic DeformationChemistrySpontaneous Interfacial ReactionThin Film Processing	1994	353
Low Schottky barrier of rare-earth silicide on <i>n</i>-Si K. N. Tu, R. D. Thompson, B-Y. Tsaur Applied Physics Letters SemiconductorsMaterials SciencePassivation CoatingEngineeringSurface Science	1981	353
Solder reaction-assisted crystallization of electroless Ni–P under bump metallization in low cost flip chip technology Jihun Jang, P. G. Kim, K. N. Tu, Journal of Applied Physics EngineeringCrystal Growth TechnologySolid-state ChemistrySolder Reaction-assisted CrystallizationBump Metallization	1999	282

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