Ke Zeng

Statistics

Publications

Citations

5.2K

H-Index

Active since

1994

Affiliations

University at Buffalo, State University of New York(Current)

Stanford University

Dalian University of Technology

University of California, Los Angeles

Central South University

Ke Zeng is an author at University at Buffalo, State University of New York specializing in materials science, engineering, and materials engineering.

ORCID

Publications per year

1994–2025

Publications

Six cases of reliability study of Pb-free solder joints in electronic packaging technology

Ke Zeng, K. N. Tu · Materials Science and Engineering R Reports · 2002 · 1.4K citations

Engineering, Materials Engineering, Materials Science +15

Tin–lead (SnPb) solder reaction in flip chip technology

K. N. Tu, Ke Zeng · Materials Science and Engineering R Reports · 2001 · 589 citations

Engineering, Materials Engineering, Materials Science +10

Morphology, kinetics, and thermodynamics of solid-state aging of eutectic SnPb and Pb-free solders (Sn–3.5Ag, Sn–3.8Ag–0.7Cu and Sn–0.7Cu) on Cu

T. Y. Lee, Woon‐Seop Choi, K. N. Tu et al. · Journal of materials research/Pratt's guide to venture capital sources · 2002 · 253 citations

Natural Sciences, Materials Engineering, Materials Science +13

Field-Plated Lateral Ga2O3 MOSFETs With Polymer Passivation and 8.03 kV Breakdown Voltage

Shivam Sharma, Ke Zeng, Sudipto Saha et al. · IEEE Electron Device Letters · 2020 · 230 citations

Engineering, Electrical Engineering, Materials Science +17

1.85 kV Breakdown Voltage in Lateral Field-Plated Ga2O3 MOSFETs

Ke Zeng, Abhishek Vaidya, Uttam Singisetti · IEEE Electron Device Letters · 2018 · 221 citations

Engineering, Electrical Engineering, Materials Science +14

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