Concepedia

Ke Zeng

KZ

48

Publications

5.1K

Citations

32

H-Index

1994

Active since

Affiliations

University at Buffalo, State University of New York(Current)

Stanford University

Dalian University of Technology

University of California, Los Angeles

Central South University

Ke Zeng is an author at University at Buffalo, State University of New York specializing in engineering, materials science, and applied physics.

Top concepts

EngineeringMaterial ScienceApplied PhysicsElectrical EngineeringMicroelectronicsMaterials EngineeringThermodynamicsChemistryHeat TransferThermal Engineering

Publications per year

1994–2025

48

Publications

48

Six cases of reliability study of Pb-free solder joints in electronic packaging technology

Ke Zeng, K. N. Tu · Materials Science and Engineering R Reports · 2002 · 1.3K citations

Reliability, Electrical Engineering, Reliability Engineering +10

Tin–lead (SnPb) solder reaction in flip chip technology

K. N. Tu, Ke Zeng · Materials Science and Engineering R Reports · 2001 · 587 citations

Materials Science, Engineering, Advanced Packaging (Semiconductors) +4

Morphology, kinetics, and thermodynamics of solid-state aging of eutectic SnPb and Pb-free solders (Sn–3.5Ag, Sn–3.8Ag–0.7Cu and Sn–0.7Cu) on Cu

T. Y. Lee, Woon‐Seop Choi, K. N. Tu et al. · Journal of materials research/Pratt's guide to venture capital sources · 2002 · 252 citations

Materials Science, Engineering, Pb-free Solders +8

Field-Plated Lateral Ga<sub>2</sub>O<sub>3</sub> MOSFETs With Polymer Passivation and 8.03 kV Breakdown Voltage

Shivam Sharma, Ke Zeng, Sudipto Saha et al. · IEEE Electron Device Letters · 2020 · 223 citations

Device Modeling, Electrical Engineering, Electronic Devices +14

1.85 kV Breakdown Voltage in Lateral Field-Plated Ga<sub>2</sub>O<sub>3</sub> MOSFETs

Ke Zeng, Abhishek Vaidya, Uttam Singisetti · IEEE Electron Device Letters · 2018 · 217 citations

Materials Science, Electrical Engineering, Engineering +11

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