Publication | Closed Access

Six cases of reliability study of Pb-free solder joints in electronic packaging technology

ReliabilityElectrical EngineeringReliability EngineeringEngineeringReliability StudyAdvanced Packaging (Semiconductors)Hardware ReliabilitySix CasesChip On BoardChip AttachmentElectronic Packaging TechnologyElectronic PackagingPhysic Of Failure