Materials Science and Engineering R Reports · 2002 · 1.4K citations · 93 references
EngineeringMaterials EngineeringMaterials ScienceElectronic MaterialsChip PackagingDevice ReliabilityPackage Integrity TestingPackaging EngineeringSemiconductor ReliabilityStructural ReliabilityCase Study ReliabilityPackage ReliabilityPackage-level ReliabilityPackaging Reliability TestingSolder Joint Residual StressSolder Joint StrengthSoldered JointsSoldering Joints
93
Max Hansen, K. Anderko, H. W. Salzberg · Journal of The Electrochemical Society · 1958 · 14.8K citations
Diffusional Viscosity of a Polycrystalline Solid
Conyers Herring · Journal of Applied Physics · 1950 · 2.5K citations
Thin Films—Interdiffusion and Reactions
J. M. Poate, K. N. Tu, Jean-Claude Mayor et al. · Journal of The Electrochemical Society · 1979 · 1.7K citations
Natural Sciences, Materials Engineering, Materials Science +12