M. A. Korhonen

Stress evolution due to electromigration in confined metal lines

M. A. Korhonen, P. Bo rgesen, K. N. Tu et al. · Journal of Applied Physics · 1993 · 724 citations

Engineering, Back Stresses, Chip Level +19

The microstructure of Sn in near-eutectic Sn–Ag–Cu alloy solder joints and its role in thermomechanical fatigue

Donald W. Henderson, James J. Woods, Timothy Gosselin et al. · Journal of materials research/Pratt's guide to venture capital sources · 2004 · 197 citations

Materials Science, Materials Engineering, Engineering +6

Mechanisms of thermal stress relaxation and stress-induced voiding in narrow aluminum-based metallizations

M. A. Korhonen, C. A. Paszkiet, Che‐Yu Li · Journal of Applied Physics · 1991 · 106 citations

Aluminium Nitride, Engineering, Severe Plastic Deformation +20

Microstructure based statistical model of electromigration damage in confined line metallizations in the presence of thermally induced stresses

M. A. Korhonen, P. Bo rgesen, D. D. Brown et al. · Journal of Applied Physics · 1993 · 102 citations

Engineering, Mechanical Engineering, Confined Line Metallizations +24

Residual stress measurements of thin aluminum metallizations by continuous indentation and x-ray stress measurement techniques

W. R. LaFontaine, C. A. Paszkiet, M. A. Korhonen et al. · Journal of materials research/Pratt's guide to venture capital sources · 1991 · 99 citations

Materials Science, Engineering, Continuous Indentation +11