M. A. Korhonen - Concepedia

Author

M. A. Korhonen

Cornell University

Also Known As

M. A. Korhonen, M. Korhonen, M.A. Korhonen, Matt A. Korhonen, Matt Korhonen

101

Publications

2.3K

Citations

H-Index

Concepts

All Affiliations

Cornell University IBM (United States)Division of Materials Science and Engineering Technische Universität Dresden Endicott College

About

M. A. Korhonen is an author at Cornell University specializing in engineering, materials science, and electronic packaging.

Top Concepts

#	Concept	H-Index	Publications	Citations
1	Engineering	20	30	2K
2	Applied Physics	15	19	1.4K
3	Natural Sciences	1	1	29
4	Chemical Engineering	1	1	65
5	Chemistry	1	1	17

M. A. Korhonen

Publications

Citations

H-Index

Page 1

	Year	Citations
Stress evolution due to electromigration in confined metal lines M. A. Korhonen, P. Bo rgesen, K. N. Tu, Journal of Applied Physics EngineeringBack StressesChip LevelIntegrated CircuitsStress Evolution	1993	724
The microstructure of Sn in near-eutectic Sn–Ag–Cu alloy solder joints and its role in thermomechanical fatigue Donald W. Henderson, James J. Woods, Timothy Gosselin, Journal of materials research/Pratt's guide to venture capital sources Materials ScienceMaterials EngineeringEngineeringMechanical EngineeringAlloy Design	2004	197
Mechanisms of thermal stress relaxation and stress-induced voiding in narrow aluminum-based metallizations M. A. Korhonen, C. A. Paszkiet, Che‐Yu Li Journal of Applied Physics Aluminium NitrideEngineeringSevere Plastic DeformationThermal Stress-induced VoidingVoid Growth	1991	106
Microstructure based statistical model of electromigration damage in confined line metallizations in the presence of thermally induced stresses M. A. Korhonen, P. Bo rgesen, D. D. Brown, Journal of Applied Physics EngineeringMechanical EngineeringConfined Line MetallizationsDamage MechanismReliability Engineering	1993	102
Residual stress measurements of thin aluminum metallizations by continuous indentation and x-ray stress measurement techniques W. R. LaFontaine, C. A. Paszkiet, M. A. Korhonen, Journal of materials research/Pratt's guide to venture capital sources Materials ScienceEngineeringContinuous IndentationSevere Plastic DeformationMechanical Engineering	1991	99
Stress relaxation of passivated aluminum line metallizations on silicon substrates M. A. Korhonen, R. D. Black, Che‐Yu Li Journal of Applied Physics EngineeringSevere Plastic DeformationResidual StressEshelby TheoryStructural Materials	1991	90
Reactions of lead-free solders with CuNi metallizations Tia‐Marje Korhonen, Peng Su, Sukwon Hong, Journal of Electronic Materials Materials ScienceChemical EngineeringEngineeringCorrosionMetallurgical Interaction	2000	65
Isothermal Fatigue Behavior of the Near-Eutectic Sn-Ag-Cu Alloy between −25°C and 125°C Tia‐Marje Korhonen, L.P. Lehman, M. A. Korhonen, Journal of Electronic Materials Materials EngineeringNear-eutectic Sn-ag-cu AlloyMaterials ScienceEngineeringIsothermal Fatigue Behavior	2007	62
The effect of current density and stripe length on resistance saturation during electromigration testing R. G. Filippi, R. Wachnik, H. Aochi, Applied Physics Letters Materials EngineeringElectrical EngineeringResistance ChangeEngineeringSpecific Resistance	1996	53
Stress-induced nucleation of voids in narrow aluminum-based metallizations on silicon substrates M. A. Korhonen, W. R. LaFontaine, P. Bo rgesen, Journal of Applied Physics EngineeringSevere Plastic DeformationCold WorkingSilicon SubstratesResidual Stress	1991	49

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