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The microstructure of Sn in near-eutectic Sn–Ag–Cu alloy solder joints and its role in thermomechanical fatigue

DOI

197

Citations

13

References

2004

Year

Donald W. Henderson, James J. Woods, Timothy Gosselin, Jay Bartelo, David E. King, Tia‐Marje Korhonen, M. A. Korhonen, L.P. Lehman, E. J. Cotts, Sung K. Kang,
Journal of materials research/Pratt's guide to venture capital sources

References

YearCitations

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