L.P. Lehman

Influence of Sn Grain Size and Orientation on the Thermomechanical Response and Reliability of Pb-free Solder Joints

Thomas R. Bieler, Hairong Jiang, L.P. Lehman et al. · IEEE Transactions on Components and Packaging Technologies · 2008 · 257 citations

Friction Welding, Engineering, Severe Plastic Deformation +16

Cyclic twin nucleation in tin-based solder alloys

L.P. Lehman, Yan Xing, Thomas R. Bieler et al. · Acta Materialia · 2010 · 208 citations

Materials Science, Materials Engineering, Engineering +6

The microstructure of Sn in near-eutectic Sn–Ag–Cu alloy solder joints and its role in thermomechanical fatigue

Donald W. Henderson, James J. Woods, Timothy Gosselin et al. · Journal of materials research/Pratt's guide to venture capital sources · 2004 · 197 citations

Materials Science, Materials Engineering, Engineering +6

Growth of Sn and intermetallic compounds in Sn-Ag-Cu solder

L.P. Lehman, S. N. Athavale, Travis Z. Fullem et al. · Journal of Electronic Materials · 2004 · 170 citations

Materials Engineering, Materials Science, Intermetallic Compounds +5

Grain-boundary character and grain growth in bulk tin and bulk lead-free solder alloys

Adwait U. Telang, Thomas R. Bieler, J. P. Lucas et al. · Journal of Electronic Materials · 2004 · 134 citations

Materials Science, Materials Engineering, Engineering +10