J. P. Lucas

Characterization of the growth of intermetallic interfacial layers of Sn-Ag and Sn-Pb eutectic solders and their composite solders on Cu substrate during isothermal long-term aging

S. Choi, Thomas R. Bieler, J. P. Lucas et al. · Journal of Electronic Materials · 1999 · 215 citations

Natural Sciences, Materials Engineering, Materials Science +17

Grain-boundary character and grain growth in bulk tin and bulk lead-free solder alloys

Adwait U. Telang, Thomas R. Bieler, J. P. Lucas et al. · Journal of Electronic Materials · 2004 · 134 citations

Natural Sciences, Materials Engineering, Materials Science +17

Moisture effect on SiCp/6061 Al MMC: Dissolution of interfacial Al4C3

J.K. Park, J. P. Lucas · Scripta Materialia · 1997 · 123 citations

Natural Sciences, Materials Engineering, Materials Science +14

Processing and aging characteristics of eutectic Sn-3.5Ag solder reinforced with mechanically incorporated Ni particles

Fei Guo, Jessica Lee, S. Choi et al. · Journal of Electronic Materials · 2001 · 107 citations

Natural Sciences, Materials Engineering, Materials Science +12

Influence of transverse normal stress on sheet metal formability

L. M. Smith, Ronald C. Averill, J. P. Lucas et al. · International Journal of Plasticity · 2002 · 96 citations

Natural Sciences, Materials Engineering, Materials Science +14