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Grain-boundary character and grain growth in bulk tin and bulk lead-free solder alloys

DOI

134

Citations

6

References

2004

Year

Adwait U. Telang, Thomas R. Bieler, J. P. Lucas, K. N. Subramanian, L.P. Lehman, Yan Xing, E. J. Cotts
Journal of Electronic Materials

References

YearCitations

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