Adwait U. Telang

Grain-boundary character and grain growth in bulk tin and bulk lead-free solder alloys

Adwait U. Telang, Thomas R. Bieler, J. P. Lucas et al. · Journal of Electronic Materials · 2004 · 134 citations

Materials Science, Materials Engineering, Engineering +10

Incremental recrystallization/grain growth driven by elastic strain energy release in a thermomechanically fatigued lead-free solder joint

Adwait U. Telang, Thomas R. Bieler, A. Zamiri et al. · Acta Materialia · 2007 · 117 citations

Materials Science, Engineering, Severe Plastic Deformation +10

The orientation imaging microscopy of lead-free Sn-Ag solder joints

Adwait U. Telang, Thomas R. Bieler · JOM · 2005 · 93 citations

Materials Engineering, Materials Science, Engineering +6

Characterization of microstructure and crystal orientation of the tin phase in single shear lap Sn–3.5Ag solder joint specimens

Adwait U. Telang, Thomas R. Bieler · Scripta Materialia · 2005 · 74 citations

Materials Science, Engineering, Mechanical Engineering +5

Analysis of Slip Behavior in a Single Shear Lap Lead-Free Solder Joint During Simple Shear at 25°C and 0.1/s

Thomas R. Bieler, Adwait U. Telang · Journal of Electronic Materials · 2009 · 42 citations

Engineering, Mechanical Engineering, Simple Shear +2