Adwait U. Telang - Concepedia

Author

Adwait U. Telang

Michigan State University

Also Known As

A. U. Telang, A.U. Telang, Adwait U. Telang

Publications

536

Citations

H-Index

Concepts

All Affiliations

Michigan State University

About

Adwait U. Telang is an author at Michigan State University specializing in engineering, materials science, and microstructure.

Top Concepts

#	Concept	H-Index	Publications	Citations
1	Engineering	7	7	525
2	Materials Science	6	6	483
3	Mechanical Engineering	5	5	298
4	Materials Engineering	2	2	227
5	Applied Physics	1	1	134

Adwait U. Telang

Publications

525

Citations

H-Index

Page 1

	Year	Citations
Grain-boundary character and grain growth in bulk tin and bulk lead-free solder alloys Adwait U. Telang, Thomas R. Bieler, J. P. Lucas, Journal of Electronic Materials Materials ScienceMaterials EngineeringEngineeringPowder MetallurgyCorrosion	2004	134
Incremental recrystallization/grain growth driven by elastic strain energy release in a thermomechanically fatigued lead-free solder joint Adwait U. Telang, Thomas R. Bieler, A. Zamiri, Acta Materialia Materials ScienceEngineeringSevere Plastic DeformationMechanical EngineeringCold Working	2007	117
The orientation imaging microscopy of lead-free Sn-Ag solder joints Adwait U. Telang, Thomas R. Bieler JOM Materials EngineeringMaterials ScienceEngineeringMicroscopyScanning Probe Microscopy	2005	93
Characterization of microstructure and crystal orientation of the tin phase in single shear lap Sn–3.5Ag solder joint specimens Adwait U. Telang, Thomas R. Bieler Scripta Materialia Materials ScienceEngineeringMechanical EngineeringTin PhaseCrystal Orientation	2005	74
Analysis of Slip Behavior in a Single Shear Lap Lead-Free Solder Joint During Simple Shear at 25°C and 0.1/s Thomas R. Bieler, Adwait U. Telang Journal of Electronic Materials EngineeringMechanical EngineeringSimple ShearSlip BehaviorMechanics Of Materials	2009	42
Grain boundary sliding on near-7°, 14°, and 22° special boundaries during thermomechanical cycling in surface-mount lead-free solder joint specimens Adwait U. Telang, Thomas R. Bieler, M.A. Crimp Materials Science and Engineering A Materials ScienceThermomechanical CyclingEngineeringMechanical EngineeringThermodynamics	2005	37
Comparisons of experimental and computed crystal rotations caused by slip in crept and thermomechanically fatigued dual-shear eutectic Sn-Ag solder joints Adwait U. Telang, Thomas R. Bieler, D.E. Mason, Journal of Electronic Materials Materials ScienceFriction WeldingEngineeringSevere Plastic DeformationMechanical Engineering	2003	28

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