Characterization of microstructure and crystal orientation of the tin phase in single shear lap Sn–3.5Ag solder joint specimens

Lead (Pb)-free solders for electronic packaging

Sung K. Kang, Amit Sarkhel · Journal of Electronic Materials · 1994 · 333 citations

Agriculture, Materials Engineering, Materials Science +8

Ag₃Sn plate formation in the solidification of near ternary eutectic Sn–Ag–Cu alloys

Donald W. Henderson, Timothy Gosselin, Amit Sarkhel et al. · Journal of materials research/Pratt's guide to venture capital sources · 2002 · 200 citations

Engineering, Materials Engineering, Materials Science +10

Progress in the design of new lead-free solder alloys

M. McCormack, Sungho Jin · JOM · 1993 · 116 citations

Natural Sciences, Materials Engineering, Materials Science +9

Orientation imaging studies of Sn-based electronic solder joints

A. Telang, Thomas R. Bieler, S. Choi et al. · Journal of materials research/Pratt's guide to venture capital sources · 2002 · 93 citations

Natural Sciences, Materials Engineering, Materials Science +6

The mechanical behavior of interconnect materials for electronic packaging

D. R. Frear · JOM · 1996 · 83 citations

Engineering, Materials Engineering, Materials Science +16