Concepedia

A. Telang

AT

4

Publications

194

Citations

4

H-Index

2002

Active since

Affiliations

Michigan State University(Current)

A. Telang is an author at Michigan State University specializing in engineering, mechanics of materials, and electronic packaging.

Top concepts

Publications per year

2002–2002

4

Publications

4

Orientation imaging studies of Sn-based electronic solder joints

A. Telang, Thomas R. Bieler, S. Choi et al. · Journal of materials research/Pratt's guide to venture capital sources · 2002 · 93 citations

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Modeling thermomechanical fatigue behavior of Sn-Ag solder joints

Jin Gyun Lee, A. Telang, K. N. Subramanian et al. · Journal of Electronic Materials · 2002 · 68 citations

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Damage accumulation under repeated reverse stressing of Sn-Ag solder joints

K. C. Chen, A. Telang, Jin Gyun Lee et al. · Journal of Electronic Materials · 2002 · 18 citations

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Surface damage accumulation in Sn–Ag solder joints under large reversed strains

Jane A. Howell, A. Telang, Jin Gyun Lee et al. · Journal of Materials Science Materials in Electronics · 2002 · 15 citations

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