A. Telang - Concepedia

Author

A. Telang

Also Known As

A. A. Telang, A. Telang, Anandkumar Telang .

Publications

208

Citations

H-Index

Concepts

All Affiliations

A. Telang is an author at Michigan State University specializing in engineering, mechanics of materials, and electronic packaging.

#	Concept	H-Index	Publications	Citations
1	Engineering	3	3	179
2	Applied Physics	1	1	93
3	Materials Engineering	1	1	93
4	Materials Science	1	1	18
5	Mechanical Engineering	1	1	68

A. Telang

Publications

194

Citations

H-Index

Page 1

	Year	Citations
Orientation imaging studies of Sn-based electronic solder joints A. Telang, Thomas R. Bieler, S. Choi, Journal of materials research/Pratt's guide to venture capital sources Materials EngineeringSurface CharacterizationFriction WeldingEngineeringSurface Analysis	2002	93
Modeling thermomechanical fatigue behavior of Sn-Ag solder joints Jin Gyun Lee, A. Telang, K. N. Subramanian, Journal of Electronic Materials Friction WeldingEngineeringMechanical EngineeringThermomechanical Fatigue BehaviorElectronic Packaging	2002	68
Damage accumulation under repeated reverse stressing of Sn-Ag solder joints K. C. Chen, A. Telang, Jin Gyun Lee, Journal of Electronic Materials Materials ScienceDamage MechanismEngineeringDurability PerformanceCorrosion	2002	18
Surface damage accumulation in Sn–Ag solder joints under large reversed strains Jane A. Howell, A. Telang, Jin Gyun Lee, Journal of Materials Science Materials in Electronics	2002	15

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