Donald W. Henderson - Concepedia

Concepedia

Author

Donald W. Henderson

IBM (United States)

Also Known As

Donald W Henderson, Donald W. Henderson

17

Publications

2.1K

Citations

14

H-Index

44

Concepts

All Affiliations

IBM (United States)Cornell University Binghamton University Endicott College IBM Research - Thomas J. Watson Research Center

DW

About

Donald W. Henderson is an author at IBM (United States) specializing in materials science, engineering, and materials engineering.

Top Concepts

#	Concept	H-Index	Publications	Citations
1	Engineering	12	12	1.8K
2	Applied Physics	6	6	715
3	Medicine	1	1	22
4	Public Health	1	1	22
5	Chemical Engineering	1	1	19

Donald W. Henderson

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14

Publications

2.1K

Citations

14

H-Index

	Year	Citations
Thermal analysis of non-isothermal crystallization kinetics in glass forming liquids Donald W. Henderson Journal of Non-Crystalline Solids Materials ScienceGlass-ceramicEngineeringGlass-forming LiquidGlass Transition	1979	734
Effect of Sn grain orientation on electromigration degradation mechanism in high Sn-based Pb-free solders Minhua Lu, Da‐Yuan Shih, Paul Lauro, Applied Physics Letters Materials EngineeringMaterials ScienceElectrical EngineeringSncu SoldersBump Metallurgy	2008	246
Experimental analysis of non-isothermal transformations involving nucleation and growth Donald W. Henderson Journal of thermal analysis	1979	242
Ag<sub>3</sub>Sn plate formation in the solidification of near ternary eutectic Sn–Ag–Cu alloys Donald W. Henderson, Timothy Gosselin, Amit Sarkhel, Journal of materials research/Pratt's guide to venture capital sources Materials EngineeringMaterials ScienceEngineeringApplied PhysicsAlloy Design	2002	198
The microstructure of Sn in near-eutectic Sn–Ag–Cu alloy solder joints and its role in thermomechanical fatigue Donald W. Henderson, James J. Woods, Timothy Gosselin, Journal of materials research/Pratt's guide to venture capital sources Materials ScienceMaterials EngineeringEngineeringMechanical EngineeringAlloy Design	2004	197
Controlling Ag3Sn plate formation in near-ternary-eutectic Sn-Ag-Cu solder by minor Zn alloying Sung K. Kang, Da‐Yuan Shih, Donovan N. Leonard, JOM Materials ScienceMaterials EngineeringEngineeringCorrosionAg3sn Plate Formation	2004	156
Viscosity and crystallization kinetics of As2Se3 Donald W. Henderson, D. G. Ast Journal of Non-Crystalline Solids Materials ScienceCrystallization KineticsChemical KineticsEngineeringRheology	1984	82
Isothermal Fatigue Behavior of the Near-Eutectic Sn-Ag-Cu Alloy between −25°C and 125°C Tia‐Marje Korhonen, L.P. Lehman, M. A. Korhonen, Journal of Electronic Materials Materials EngineeringNear-eutectic Sn-ag-cu AlloyMaterials ScienceEngineeringIsothermal Fatigue Behavior	2007	62
The Microstructure, Thermal Fatigue, and Failure Analysis of Near-Ternary Eutectic Sn-Ag-Cu Solder Joints Sung K. Kang, Paul Lauro, Da‐Yuan Shih, MATERIALS TRANSACTIONS Friction WeldingEngineeringMechanical EngineeringSolidification BehaviorFailure Analysis	2004	47
Sporadic Degradation in Board Level Drop Reliability - Those Aren't All Kirkendall Voids! Peter Børgesen, Liang Yin, Pericles A. Kondos, EngineeringSurface IntegrityDefect ToleranceKirkendall VoidingReliability Engineering	2007	38

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