Da‐Yuan Shih

Effect of Sn grain orientation on electromigration degradation mechanism in high Sn-based Pb-free solders

Minhua Lu, Da‐Yuan Shih, Paul Lauro et al. · Applied Physics Letters · 2008 · 246 citations

Materials Engineering, Materials Science, Electrical Engineering +13

High-speed signal propagation on lossy transmission lines

A. Deutsch, G.V. Kopcsay, V. A. Ranieri et al. · IBM Journal of Research and Development · 1990 · 207 citations

Electrical Engineering, Engineering, Dielectric Dispersion +10

Ag₃Sn plate formation in the solidification of near ternary eutectic Sn–Ag–Cu alloys

Donald W. Henderson, Timothy Gosselin, Amit Sarkhel et al. · Journal of materials research/Pratt's guide to venture capital sources · 2002 · 198 citations

Materials Engineering, Materials Science, Engineering +6

The microstructure of Sn in near-eutectic Sn–Ag–Cu alloy solder joints and its role in thermomechanical fatigue

Donald W. Henderson, James J. Woods, Timothy Gosselin et al. · Journal of materials research/Pratt's guide to venture capital sources · 2004 · 197 citations

Materials Science, Materials Engineering, Engineering +6

Ag3Sn plate formation in the solidification of near-ternary eutectic Sn-Ag-Cu

Sung K. Kang, Da‐Yuan Shih, NY. Donald et al. · JOM · 2003 · 163 citations

Materials Science, Materials Engineering, Engineering +6